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Huawei Ascend Mate 7 Fingerprint Sensor

Publié
02/04/2015
Code produit
SP15212
Prix
2 990 EUR
Applications
Grand public
Extrait disponible Brochure disponible Demande d'info

Huawei’s technological choice for the fingerprint sensor is going to the opposite direction than Apple’s and Samsung’s one. The Ascend Mate 7 presents an innovative fingerprint sensor developed by Fingerprint Cards, a main actor in capacitive sensing human interface solutions for consumer electronics companies.

The technical choice of Fingerprint Cards is totally different form the other’s. The fingerprint device is much more bigger and more expensive than its competitors (2.5 factor) to guarantee a better image quality. It presents a new sensing device design and structure; an innovative packaging and a different supply chain model.

The fingerprint sensor of the Ascend Mate 7 is located on the back side of the telephone and it has the dimension of 16.33×15.8 mm. The sensor is assembled on LGA packaging and incorporated within a rectangular shaped housing composed of an aluminum ring and plastic ring.

The report presents a detailed analysis of fingerprint structure and cost and a comparison with the Apple’s iPhone5 and Samsung’s Galaxy S5 fingerprint sensors.

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Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile

  • Fingerprint Cards

Physical Analysis

  • Synthesis of the Physical Analysis
  • Ascend Mate 7 Fingerprint disassembly
  • Fingerprint Sensor Views
  • Fingerprint Sensor Croos-Section
  • Fingerprint Sensor Patents
  • ASIC Die View & Dimensions
  • ASIC Die marking
  • ASIC Die Capacitors
  • ASIC Die Edge Contact
  • ASIC Delayering & main Blocs
  • ASIC Die Process
  • ASIC Die Cross-Section
  • ASIC Die Process Characteristic

Sensor Manufacturing Process

  • ASIC Front-End Process
  • ASIC Front-End Wafer Fabrication Unit
  • Packaging Process
  • Packaging Fabrication Unit
  • Synthesis of the main parts

Cost Analysis  

  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Explanation
  • Yields Hypotheses
  • ASIC Wafer Cost
  • ASIC Die Cost

LGA Packaged Component

  • LGA Packaging Cost
  • Components Cost

Fingerprint Module Cost

  • Components Cost
  • Fingerprint Sensor Assembly Cost

Huawei’s vs Samsung’s vs Apple’s fingerprint sensor

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