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MEMS Oscillateur

Discera DSC8002 MEMS Oscillator

Publié
15/12/2010
Code produit
SP10050
Prix
1 990 EUR
Applications
Extrait disponible Brochure disponible Demande d'info

System Plus Consulting is proud to publish the reverse costing report of the new generation of MEMS oscillator supplied by Discera.

The DSC8002 is a programmable CMOS oscillator incorporating a Silicon MEMS resonator. Thanks to the TSV technology of Silex Microsystems (TSI™, Through Silicon Insulator), this new generation of Discera wafer-level packaged MEMS resonator achieves an area of ~0.3mm².

The DSC8002 is available in industry standard packages (2.5 x 2.0 x 0.85 mm, 3.2 x 2.5 x 0.85 mm, 5.0 x 3.2 x 0.85 mm and 7.0 x 5.0 x 0.85 mm) and can replace standard crystal oscillators.

This report provides complete teardown of the MEMS oscillator with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

 Discera Company Profile

  • Product Range
  • Business Model

 Physical analysis

  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package Opening
  • Package Cross-Section
  • ASIC – Dimensions
  • ASIC – Markings
  • ASIC – Optical Views
  • ASIC – Delayering
  • ASIC – Cross-Section
  • ASIC Process Characteristics
  • MEMS – Dimensions & Markings
  • MEMS – Cap Opening
  • MEMS – Resonator
  • MEMS – Cap
  • MEMS – Cross-Section
  • MEMS Process Characteristics
  • Comparison with Previous Generation

Manufacturing Process Flow

  • Overview
  • MEMS Process Flow
  • Description of the Wafer Fabrication Units

 Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Supply Chain Analysis
  • Manufacturers financial ratios
  • Yields Explanation
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 Cost (Probe Test and Dicing)
  • ASIC Die Cost (Front End + Back End 0)
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • MEMS Back-End 0 Cost (Probe Test and Dicing)
  • MEMS Die Cost (Front End + Back End 0)
  • Back-End 1 : Packaging Cost
  • Back-End 1 : Final Test Cost
  • DSC8002 Component Cost (FE + BE 0 + BE 1)

 Estimated Manufacturer Price Analysis

Conclusion

 

 

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