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Cree Xlamp® XB-D Cool White : LED

Code produit
1 990 EUR
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System Plus Consulting is proud to publish the reverse costing report of the Xlamp® XB-D, the new cool white
LED supplied by Cree, Inc.

Manufactured in the new Cree SC³ technology, the component integrates a silicon carbide LED chip and a silicon protective diode in a tiny ceramic package (2,45mm x 2,45mm).

The LED chip structure, designed to maximize light extraction, the phosphor technology and the package design allow the XB-D LED to delivers up to 136 Lm/W.

The LED is targeted for all types of lights, including bulbs, commercial lighting, and streetlights.

This report provides a complete teardown of the LED with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation


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1. Overview / Introduction

2. Company Profiles

3. Physical Analysis

  • About the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics
  • Package Dimensions
  • Package Main Components
  • Package Substrate
  • Package Phosphor
  • Package Synthesis
  • LED Optical details
  • LED active Side
  • LED Synthesis

4. Manufacturing Process Flow

  • LED Die Process Flow
  • Packaging Process Flow
  • Description of the Wafer Fabrication Units
  • Description of the Assembly Unit

5. Cost Analysis

  • Yield Hypotheses
  • LED Front-End Cost
  • Front-End : Epitaxy Cost
  • Front-End : Other Front-End Cost
  • Front-End : Cost per Equipment Family
  • Front-End : Cost per Consumable
  • Dies per Wafer & Probe Test
  • Back-End 0 : Probe Cost & Dicing
  • LED Die Cost
  • Back-End 1 : Packaging Cost & Final test
  • Component Manufacturing Cost

6. Estimated Manufacturer Price Analysis

  • Price definitions
  • Manufacturers financial ratios
  • Binning Impact on Manufacturing Price
  • Ideal manufacturer Price
  • Manufacturing Price with Binning Yield





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