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CREE CXA1520 – CREE’s Flip Chip first High Density LED array

Publié
26/06/2014
Code produit
SP14175
Prix
2 990 EUR
Applications
Extrait disponible Brochure disponible Demande d'info

The CXA1520 is the first high density LED array from CREE. With a breakdown voltage of 35V for a current of 0.5A (85°C), the CXA1520 generate 1710 lumens for 3000K and a CRI of 80% in a “15.85mmx15.85mm” package. The combination of Cree’s proprietary Flip Chip SiC LEDs and high performance COB packaging, offers the one of best lumen density performance on the market.

The CXA1520 package has a very low thermal-resistance allowing for a lumen density similar to the one of discrete packaged LED but with a “lumen per $” 30% higher (compared to equivalent package).

This reverse costing report provides an estimation of the production cost of the CXA1520-0000-000N00N430F. Describes the overall manufacturing process and highlights key points of innovation developed by CREE.

 

 

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1. Overview / Introduction

  • Executive Summary
  • Comparison of LEDS
  • Reverse Costing Methodology

2. Companies Profile

  • CREE Profile

3. IPD65R225C7 Characteristics

  • CXA1520 Characteristics

4. IPD65R225C7 Physical Analysis

  • Package Views & Dimensions
  • Package Opening
  • Package Cross-Section
  • Phosphor
  • LED Assembly
  • LED Views & Dimensions
  • LED Singulation
  • Cathode and Anode
  • Dielectric Layers
  • Epitaxy
  • LED Thickness
  • LED Characteristics

5. Manufacturing Process Flow

  • Global Overview
  • LED Fabrication Unit
  • LED Process Flow
  • Package Fabrication Unit
  • Package Process Flow

6. Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • Epitaxy Step
  • LED Front-End Cost
  • LED Wafer Cost
  • LED Cost per process steps
  • LED Equipment Cost per Family
  • LED Material Cost per Family
  • Back-End : Probe and cleaving Cost
  • Packaging Cost
  • Final Assembly Cost
  • Component Cost & Price

7. Price Estimation

Contact

 

 

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