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ENCAPSULATION WLP

Casio Micronics – EWLP 309-pin – Fujitsu

Publié
15/05/2010
Code produit
SP10029
Prix
1 990 EUR
Applications
Grand public
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System Plus Consulting is proud to publish the reverse costing report of one of the latest Wafer Level Chip Scale Package based on Casio Micronics’ EWLP technology and used by Fujitsu for device MB39C311A, a Power Management Unit + Audio Interface Unit IC for mobile phone.

EWLP is an advanced technology for WL-CSP. All the packaging operations are done at the wafer level. The ball pitch is only 0.4mm and only one redistribution layer is used for the 309 balls of this 7.45×7.45 mm package. This WL-CSP is manufactured on 200mm wafers by Casio Micronics.

This report provides a complete teardown of the Casio Micronics/Fujitsu 0.4mm pitch WL-CSP package including:

  •  Detailed photos
  • Material analysis
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

 Fan-In package Principle

  • Benefits of WL-CSP
  • WL-CSP – Process Flow

 Physical Analysis

  • Physical Analysis Methodology
  • Mobile Phone & PCB
  • MB39C311A circuit
  • Underfill
  • Die in the package
  • Pads and the redistribution layer
  • Aluminum pad
  • Coupling layer
  • Die metallization and passivation
  • Bumping process
  • Copper posts
  • Summary of Physical Data

Manufacturing Process Flow

  • The Process flow main steps
  • WL-CSP Process Flow
  • Redistribution and copper post
  • Bumping and Dicing

 Cost Analysis

  • Assumptions
  • Package Yields
  • WL-CSP Wafer Cost
  • Wafer Cost by Equipment Family
  • Wafer Cost by Consumable Family
  • WL-CSP Package Cost
  • Synthesis of the Cost Analysis

 Estimated Manufacturer Price Analysis

  • Price definitions
  • Manufacturers financial ratios
  • Estimated manufacturer Price

 Conclusion

 

 

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