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MEMS IMU/Combo

Bosch Sensortec BMX055 9-Axis MEMS IMU

Publié
12/12/2013
Code produit
SP13150
Prix
2 990 EUR
Applications
Grand public
Extrait disponible Brochure disponible Demande d'info

In the race of motion integration, Bosch Sensortec has released its first 9-Axis IMU for consumer applications.

The BMX055 combines a 12-bit 3-Axis accelerometer, a 16-bit 3-Axis gyroscope and a wide-range 3-Axis geomagnetic sensor in a 4.5×3.0mm LGA package (the smallest footprint at its introduction).

It is the first 9-Axis MEMS IMU where all the functionalities are developed and manufactured by the same player.

The BMX055 integrates the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation. This report provides a complete teardown of the MEMS IMU with:

• Detailed photos

• Material analysis

• Schematic assembly description

• Manufacturing Process Flow

• In-depth manufacturing cost analysis

• Selling price estimation

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Introduction, Bosch Company Profile Physical Analysis

  • Package
  • Package Views, Dimensions & Pin Out
  • Package Opening
  • Wire bonding process
  • Package Cross-Section
  • ASIC Gyro & Accelero Dies
  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • MEMS Gyro & Accelero Dies
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Bonding)
  • Process Characteristics
  • Magnetometer Die
  • View, Dimensions & Marking
  • Hall sensor and fluxgate sensors
  • Delayering
  • Main Blocks Identification
  • Cross-Section (CMOS & Sensor)

Manufacturing Process Flow

  • ASIC Gyro & Accelero Front-End Process
  • MEMS Gyro & Accelero Process Flow
  • Magnetometer Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit Cost Analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Gyro & Accelero Front-End Cost
  • ASIC Gyro & Accelero Back-End 0 : Probe Test & Dicing
  • ASIC Gyro & Accelero Wafer & Die Cost
  • MEMS Gyro & Accelero Front-End Cost
  • MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing
  • MEMS Gyro & Accelero Wafer & Die Cost
  • Magnetometer CMOS Front-End Cost
  • Magnetometer Sensor Cost
  • Magnetometer Back-End 0 : Probe Test & Dicing
  • Magnetometer Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Final Test & Calibration Cost

BMX055 Component Cost Estimated Price Analysis

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