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Automotive Power Module Packaging Comparison 2018

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EUR 4490
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A cost-oriented review of power module packaging technologies for the automotive market.

The most recent market forecast by Yole Développement shows the global rise of power devices. The market for power module devices will follow that trend, with a 10.2% compound annual growth rate (CAGR) over the next five years. This will impact the power module packaging market, which will see a 9.5% CAGR, reaching a value of almost $1.8B.

The progress of electric and hybrid electric vehicles (EV/HEVs) is imposing new standards in terms of electrical equipment, pushing electronic components to work in non-conventional environments for longer. That poses the electronics industry new challenges regarding both performance and reliability. To meet these requirements, electronic systems have to be improved at both design and industrialization levels.

Power modules have come a long way since the early stages of car electrification. They are now playing a key role in the power modulation through all EV/HEVs, from inverters to bi-directional converters. Packaging these modules has become critical due to several technical aspects. They must combine good thermal and electrical efficiency while keeping low mass and volume. Also, to remain competitive in an open market, power module makers must deliver high reliability while remaining cost efficient.

In this report we analyzed the physical composition and cost of ten modules for automotive applications from five different manufacturers. We reviewed the different topologies and techniques used for the module packaging in such applications. We describe opening the modules, provide measurements and cross-sections, along with scanning electron microscope (SEM) and optical pictures. We analyze and simulate the cost of manufacturing and compare it to a summary panel.

This report includes comparison of the structures and costs of the different technological choices made by key manufacturers of the automotive industry.





Power Module Packaging 2018: Material Market and Technology Trends – by Yole Développement

Power packaging is continuously adapting to power application market trends.

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  • Presentation of thermomechanical issues in power modules
  • 2017-2023 market value for the power electronics field and especially for power modules
  • Complete analysis of power module packaging design
  • Deep insight into each part of a standard power module package: substrate, baseplate, die attach, substrate attach, encapsulation and interconnections
  • Technology trends and roadmaps
  • Detailed analysis of thermal interface materials (TIMs)
  • Presentation of case studies and technological innovations
  • 2017-2023 market metrics and forecasts for each type of packaging component covering substrate, baseplate, die attach, substrate attach, encapsulation, interconnections and TIMs
  • Evolution of different business models among the packaging material suppliers ecosystem
  • Supply chain analysis and evolution trends
  • Complete presentation of Wide Band Gap device packaging
  • Conclusion on the packaging trends for the coming years

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  • Executive Summary
  • Reverse Costing Methodology
  • Analyzed Devices
  • Power Module Market

Physical and Manufacturing Cost Analysis

  • Bosch
    • Company profile
    • T-PM
  • Infineon
    • Company profile
    • HybridPACK 2
    • HybridPACK drive
    • HybridPACK double side cooling
    • CoolIR
  • Mitsubishi
    • Company profile
    • J serie T-PM
  • Semikron
    • Company profile
    • SKiM
  • ST Microelectronics
    • Company profile
    • Tpak
  • Toshiba
    • Company profile
    • Case module
  • Toyota
    • Company profile
    • Molded DSC
  • Module Comparison
  • Cost Breakdown
  • Cost by Power
  • Cost by Switch
  • Cost by Surface and Volume
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