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Apple iPhone 6 & 6 Plus Rear Camera Modules from Sony

Publié
14/11/2014
Code produit
SP14192A
Prix
2 990 EUR
Applications
Grand public
Extrait disponible Brochure disponible Demande d'info

With the iPhone 6 & 6 Plus iSight camera modules, Apple improves the logic ISP circuit, passing from 65nm to 45nm technology node process, and introduces the Optical Image Stabilization system.

The iPhone 6 Plus  camera module integrates the 8Mpixel resolution CMOS Image Sensor, with aperture of f/2.2 and a pixel size of 1.5µm, in a new bigger and flexible packaging concept.

The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process and uses the unique technology from Sony (Exmor-RS). The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit. This allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity.

The two camera modules, slightly different in dimensions, are both equipped with a 5-elements lens module and a VCM auto-focus actuator.

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Camera Module Supply Chain & Companies Profile

Physical Analysis

Camera Module

  • Camera Module View & Dimensions
  • Camera Module X-Ray
  • Camera Module Disassembly

CMOS Image Sensor

  • View & Dimensions
  • Pads, Tungsten Grid
  • TSV Connections
  • CIS Pixels
  • Logic Circuit (Transistors, SRAM)

Cross-Section: Camera Module

  • Overview
  • Driver (Assembly & Process) & MLCC
  • Ceramic Substrate, IR Filter & FPC
  • Lenses, Housing, VCM, IOS

Cross-Section: CMOS Image Sensor

  • Overview
  • Pad Trenches
  • Pixel Array Circuit
  • Logic Circuit
  • TSVs

Comparison with previous 8Mpixel CIS from Sony

CIS Manufacturing Process Flow

  • Global Overview
  • Logic Circuit Front-End Process
  • Pixel Array Circuit Front-End Process
  • BSI + TSV + Microlenses Process
  • CIS Wafer Fabrication Unit

Cost Analysis

  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • CMOS Image Sensor Cost
  • Logic Circuit Front-End Cost
  • Pixel Array Front-end Cost
  • BSI , IOS & TSV Front-End Cost
  • Color Filters & Microlenses Front-End Cost
  • Total Front-End Cost
  • Back-End: Tests & Dicing
  • CIS Wafer and Die Cost
  • Camera Module Assembly Cost
  • Lens Module Cost
  • VCM Actuator Cost
  • Final Cost
  • Camera Module Cost
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