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Derniers rapports de Reverse Costing disponibles

  • Intel Silicon Photonic 100G PSM4 QFSP28 Transceiver

    Deep analysis of the first silicon photonic die with Intel’s unique approach for laser integration, the outcome of 15 years of development, along with the main optoelectronic components in the connector.

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  • Sony’s 3D Time-of-Flight Depth Sensing Camera Module

    Deep analysis of the Sony’s 3D ToF Sensor and the VCSEL in the Oppo RX17 Pro.

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  • ABB LinPak 1700V 2x1000A Power Module

    The unique LinPak 1700V power module from ABB for industrial applications has an innovative, fast and rugged SPT++ chipset.

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  • Valeo SCALA Laser Scanner

    The world’s first automotive-grade LiDAR sensor for automated and autonomous driving.

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  • Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series

    Second generation of mid/high band Front-End module with advanced and innovative packaging.

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Evènements

  • Webcast: Smelling out the air quality market!

    January 15, 2019 Online

    Free Webcast – Janurary 15, 2019 at 5 PM CEST – 8 AM PDT As…

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  • 3D Systems Summit

    January 29 - 30, 2019 Dresden, Germany

      System Plus Consulting at 3D Systems Summit? Romain Fraux, CEO at System Plus Consulting, will participate…

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Nouveaux articles

  • Would Apple change the power GaN world?

    Extracted from: Power GaN: Epitaxy, Devices, Applications and Technology Trends report, Yole Développement | GaN…

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  • STMicroelectronics confirms its commitment to the power GaN industry

    INTERVIEW: STMICROELECTRONICS for i-micronews.com / @Micronews e-newsletter

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  • Biometrics for consumer: from convenience to security to feature…

    Extracted from: Consumer Biometrics: Market and Technologies Trends 2018 report, Yole Développement | And the…

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