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Rapports

Derniers rapports de Reverse Costing disponibles

  • Leading-edge 3D NAND Memory Comparison 2018

    A deep technology analysis and cost comparison report on cutting edge 3D NAND memory chips from Toshiba/SanDisk, Samsung, SK Hynix and Intel/Micron.

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  • Orbbec’s Front 3D Depth Sensing System in the Oppo Find X

    The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.

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  • Wafer to Wafer Permanent Bonding Comparison 2018

    Wafer bonding structure, process and cost analysis for CMOS image sensors, inertial, pressure and radio-frequency MEMS devices and LEDs.

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  • Bonding and Lithography Equipment Market for More than Moore Devices

    More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.

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  • Qorvo QPF4006 39GHz GaN MMIC Front End Module

    The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.

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Evènements

  • Webcast: DRAM and NAND market: What to expect?

    Free Webcast – December 6, 2018 at 5 PM CEST – 8 AM PDT Despite…

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  • Electronica 2018

    November 13 - 16, 2018

    System Plus Consulting at Electronica 2018? Elena Barbarini, Project Manager at System Plus Consulting, will…

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Nouveaux articles

  • What is driving the power electronics industry?

    Extracted from the following reports: Status of the Power Electronics Industry – Automotive Power Module…

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  • Air quality monitoring: cars, homes & buildings are driving the gas and particle sensor market

    Extracted from : Gas and Particle Sensors 2018 report from Yole Développement – Miniaturized Gas…

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  • ST’s Automotive Plans

    Article by Junko Yoshida, EETimes, November 2018

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