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Rapports

Derniers rapports de Reverse Costing disponibles

  • Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

    First consumer application in the Intel Core 8th Generation i7-8809G, the world’s first On-Package CPU and GPU with High Bandwidth Memory.

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  • Mitsubishi J1- Series 650V High-Power Modules for Automotive

    The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.

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  • Miniaturized Gas Sensor Comparison 2018

    Comparison of four gas sensors for consumer applications made by Bosch, ams and Sensirion.

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  • 1200V Silicon IGBT vs SiC MOSFET Comparison 2018

    Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETs from eight different manufacturers shows their potential.

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  • Ainstein T-79: Automotive 79GHz Short Range Radar

    A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).

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Evènements

  • SEMICON Europa

    November 13 - 16, 2018

    System Plus Consulting at SEMICON Europa? Elena Barbarini, Head of Department Devices at System Plus…

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  • IWLPC – International Wafer-Level Packaging Conference 2018

    System Plus Consulting at International Wafer-Level Packaging Conference 2018? Dr. Stéphane Elisabeth, Project Manager at…

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Nouveaux articles

  • Radar for automotive: we are entering a new age…

    Extracted from: Radar Technologies for Automotive report, 2017 edition and LiDAR for Automotive & Industrial…

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  • Power module packaging: latest innovations are driven by EV/HEV and WBG technologies

    Extracted from: Power Module Packaging 2018: Material Market & Technology Trends report, Yole Développement –…

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  • Automotive is driving SiC adoption

    Press Release by System Plus Consulting & Yole Développement, July 2018

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