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Derniers rapports de Reverse Costing disponibles

  • Navitas 650V GaNFast Power IC Family

    The first GaN monolithic devices from Navitas for fast charging.

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  • Panasonic’s 3D Time-of-Flight Depth Sensing Camera Module

    Complete 3D ToF camera with flood illuminator found in the Vivo Nex Dual Display smartphone.

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  • SiC MOSFET Comparison 2019

    Discover and compare the state of the art: 22 SiC MOSFETs from Cree/Wolfspeed, Rohm, STMicroelectronics, Littelfuse, and Infineon.

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  • LG Electronics Cluster and Infotainment Display Module in the Mercedes-Benz A-Class

    Physical and cost analysis of the instrument cluster and infotainment display module available in the latest Mercedes A-Class Style Line.

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  • Acconeer A111 60 GHz Pulsed Coherent Radar

    Radar chip in Antenna-in-Package configuration.

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Evènements

  • iMAPS ADVANCED SYSTEM IN PACKAGE (SiP) TECHNOLOGY 2019

    June 25-27, 2019 Monterey, CA - USA

    System Plus Consulting at iMAPS ADVANCED SYSTEM IN PACKAGE (SiP) TECHNOLOGY 2019? Romain Fraux, CEO at System…

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  • Advanced RF SiPs for Cellphones – Webcast

    Free Webcast – April 18, 2019 at 9 AM CET – 3 PM UTC +8…

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Nouveaux articles

  • Advanced Packaging: game-changer for semiconductor revolution

    Advanced Packaging & System Integration Technology Symposium – April 22&23 – Shanghai, China Source: Fan-out…

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  • LiDAR industry: high expectations for autonomous driving

    Extracted from: LiDAR for Automotive & Industrial Applications report and Radar & Wireless for Automotive:…

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  • The 5G revolution is pushing innovations for RF front-end SiP

    Extracted from: Advanced RF System-in-Package for Cellphones, Yole Développement, 2019 – Broadcom AFEM-8092 System-in-Package in…

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