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Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

Extracted from: Fan-Out Packaging: Technologies and Market Trends report, 2019 edition – Yole Développement | Advanced Packaging Technology in the Apple Watch Series 4’s System-in-Package report, 2019 edition, System Plus Consulting

“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP(1) for production successfully in 2018”, Under this dynamic context, advanced packaging companies are re-defining strategies to improve their market positioning or maintain their leadership. As a consequence, the supply chain is directly impacted and business models are thereby evolving. The Fan-Out packaging landscape of today is more fragmented than ever…

Yole Group of Companies including Yole and System Plus Consulting pursue its investigations towards the advanced packaging technologies and propose a significant collection of reports dedicated to Fan-Out. More than a simple description, reports performed by both partners are comprehensive analyses of the industry evolution, market trends and technology challenges.
Fan-Out Packaging: Technologies and Market Trends report and Advanced Packaging Technology in the Apple Watch Series 4 are the latest reports related to the Fan-Out technologies and proposed by the Yole Group of Companies.


Stéphane Elisabeth, PhD, Expert Cost Analyst at System Plus Consulting comments: “With the Apple Watch Series 4, the leading company has chosen to collaborate with many innovative partners including TSMC. Therefore, the application processor (AP) packaging is based on TSMC’s integrated Fan-Out (inFO) technology in the last version, called inFO-ePoP coupling Multi Chip Memory with the AP.”
With these new reports, Yole Group updates the business status of Fan-Out technologies markets with forecasts and roadmaps definition, competitive landscape, reverse engineering and costing analyses… and points out the technical challenges and impact on the supply chain. A detailed description of the advanced packaging reports is available on, advanced packaging reports section.




In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB(2), RF(3), and PMU(4). But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, market value increased 3.5x by 2017. Thus the HD(5) Fan-Out market segment was created, reducing the market-share ratio of OSATs(6).

Since then, SEMCO/Samsung (IDM(7)) has joined the Fan- Out packaging market as a new entrant and expanded it into the consumer market.

Moving forward, TSMC is betting on inFO to secure new high-end packaging projects in mobile, HPC(8), and networking. While SEMCO/Samsung continues to gain ground on TSMC in the HD Fan-Out market and generate value in core Fan-Out, OSATs will keep competing for business – but under price pressure from fabless. In this scenario, PTI may emerge as a Fan-Out packaging leader due to FOPLP’s cost-effectiveness and a possible HD FOPLP breakthrough for multi-die with logic + memory, etc.

The Fan-Out packaging market value is expected to grow at a 19% CAGR(9) between 2019 and 2024, reaching a market size of US$3.8 billion. Meanwhile, the love-hate relationships and politics surrounding OSATs, IDMs, and foundries will continue to unfold. Any big change in Fan-Out strategy will have a ripple effect on the entire supply chain.




Currently, all key OSAT/foundry/IDM players have Fan-Out packaging solutions in the market. The Fan-Out landscape remains dynamic, with more opportunities to maximize performance at a lower cost – hence the adoption of Fan-Out by various business models. In a mega-trends-driven era, Fan-Out platforms are increasingly viewed as one of the top options amongst leading package technologies.

“More OSAT players are getting even more involved in Fan-Out packaging,” says Favier Shoo from Yole. “They are the main contributors for Core Fan-Out and are all targeting volume production with different status in their development”.

In parallel, many IDMs are pushing for Fan-Out development and embedding of their dies through R&D and small series in collaboration with OSATs or for internal use only.




Under its new Fan-Out report, the consulting company Yole details the status of the Fan-Out technologies, their adoption for volume production and the evolution of the business models – See the image enclosed: business evolution between 2015 and 2024.
Analysts point out key advanced packaging players, their business models and their technical positioning:

• SEMCO/Samsung (IDM) and PTI (OSAT) focus their activities on Core Fan-Out with FOPLP.

• The foundry TSMC is developing HD Fan-Out-based solutions.

• NXP as an IDM is part of the Core Fan-Out playground. In addition to NXP, Yole also lists the following OSATs: ASE, Amkor Technology with Nanium, JCET (Stats ChipPac and JCAP), Deca and Nepes.


Moreover other companies that are pursuing Fan-Out packaging capabilities are OSATs. The list includes Amkor Technology in Korea, ASE/Deca, in Huatian and SPIL…
Yole and System Plus Consulting will present their vision of the advanced packaging industry, its evolution, the competitive landscape and forecasts all year long during key conferences and trade shows. To discover 2019, visit website.


(1) FOPLP: Fan-Out Panel Level Packaging
(2) BB: Baseband
(3) RF : Radio Frequency
(4) PMU : Power Management Unit
(5) HD : High Density
(6) OSAT : Outsourced Semiconductor Assembly and Test
(7) IDM : Integrated Devices Manufacturer
(8) HPC : High Processing Computer
(9) CAGR : Compound Annual Growth Rate



Fan-Out Packaging: Technologies and Market Trends 2019

Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield – Produced by Yole Développement.


Companies cited in the report:
3D-Plus, 3M, AGC, Amkor, Analog Devices, Akrometrix, Apple, Applied Materials, ASE, ASM, A*Star, Aurora Semiconductors, Besi, Boschmann, Brewer Science, Broadcom, Bosch, Camtek, Corning, Dialog Semiconductor, Dow, Evatec, EVGroup, Fico Molding, Freescale (NXP), Fujifilm, HD Microsystems, Henkel, Hi Silicon, Huawei, Huatian, Hitachi Chemicals, Hoya, Ibiden, IME, Infineon, Intel, ITRI, JSR, Lintec, Mediatek… Full list



• Favier Shoo is a Technology and Market Analyst in the Semiconductor & Software division at Yole Développement, part of Yole Group of Companies. Favier is engaged in the development of technology & market reports as well as the production of custom consulting. After spending 7 years at Applied Materials as a Customer-Application-Technologist in advanced packaging marketspace, Favier had developed a deep understanding of the supply chain and core business values. Being knowledgeable in this field, Favier had given trainings and held numerous technical review sessions with industry players. In addition, he had obtained 2 patents. Prior to that, Favier had worked at REC Solar as a Manufacturing Engineer to maximize production capacity. Favier holds a Bachelor in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore). Favier was also the co-founder of a startup company where he formulated business goals, revenue models and marketing plans.


Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Four major packaging technologies: ASE’s SiP & modified SESUB, TSMC’s inFO-ePoP, Skyworks’ Double Side BGA. – Produced by System Plus Consulting.



• Dr Stéphane Elisabeth is project manager in charge of RF, Advanced Packaging and Sensors at System Plus Consulting, part of Yole Group of Companies. He has joined System Plus Consulting’s team in 2015. Bringing his RF knowledge, he has started this new activity for the company. He has a deep knowledge of Materials characterizations and Electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.
• Yvon Le Goff has joined System Plus Consulting in 2011 to setup its laboratory. He previously worked for 25 years at Atmel Nantes Technological Analysis Laboratory as fab support in physical analysis, and for three years at Hirex Engineering in Toulouse, in a destructive physical analysis lab.



• Apple A11 with new generation of TSMC’s inFO

• Samsung FO-PLP packaging with the Exynos 9110

• NXP SCM-iMX6 with Nepes’ RCP-SiP Fan-Out System

• Status of the Advanced Packaging Industry 2018

In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development…  – More

• Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrate Like PCB Trends

Apple’s usage of substrate-like PCBs in the latest iPhone 8 and X will revolutionize the substrate and PCB markets… – More



System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems. Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product. System Plus Consulting engineers are experts in:
Integrated Circuits – Power Devices & Modules – MEMS & Sensors – Photonics – LED – Imaging – Display – Packaging – Electronic Boards & Systems.
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors. System Plus Consulting is a sister company of Yole Développement.
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Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS & Sensors – Imaging – Medical Technologies – Compound Semiconductors – RF Electronics – Solid State Lighting – Displays – Photonics – Power Electronics – Batteries & Energy Management – Advanced Packaging – Semiconductor Manufacturing – Software & Computing – Memory and more…

The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. . For more information, visit and follow Yole on LinkedIn and Twitter.

Yole Développement, System Plus Consulting, Knowmade, PISEO and Blumorpho are part of Yole Group of Companies.
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