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Silicon capacitor: Discover differences between technologies from TSMC, Skyworks, Murata / IPDiA and Vishay, their related costs - System Plus Consulting

Silicon Capacitor Technology and Cost Review

Report type
Reverse Costing
Manufacturer
Murata, Skyworks, TSMC, Vishay
Reference
Silicon Capacitor
Device type
Published
19/09/2017
Product Code
SP17344
Applications
Medical Mobile & Consumer
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BCD (Bipolar-CMOS-DMOS) integrated circuit (IC): comparative study on technologies from Infineon, NXP, and more manufacturers - System Plus Consulting

BCD Technology and Cost Review

Report type
Reverse CostingReverse Technology
Manufacturer
Analog Devices, Bosch, Denso, Elmos, Freescale, Infineon, Linear Technology, NXP, Renesas, STMicroelectronics, Texas Instrument, Toyota
Reference
BCD
Device type
Published
30/08/2017
Product Code
SP17335
Applications
Automotive & Mobility Industrial Mobile & Consumer
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Deep Trench Capcitors as land-side decoupling capacitors and IPD technology from TSMC used for Apple’s A10 application processor - System Plus Consulting

TSMC Deep Trench Capacitor

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC DTC
Device type
Published
18/10/2016
Product Code
SP16300
Applications
Mobile & Consumer
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New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
Published
18/10/2016
Product Code
SP16290
Applications
Mobile & Consumer
Flyer Sample
Qualcomm Snapdragon 820 MCeP Pop Embedded die System Plus Consulting

Qualcomm Snapdragon 820 & Samsung Exynos 8 PoP

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm Snapdragon 820
Device type
Published
14/06/2016
Product Code
SP16276
Applications
Mobile & Consumer
Flyer Sample
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