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SP19472 -Piezoelectric systems - external views

Piezoelectric Material From Bulk to Thin Film – Comparison 2019

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Piezoelectric Material – Comparison 2019
Device type
Published
25/09/2019
Product Code
SP19472
Applications
Automotive & Mobility Industrial Mobile & Consumer
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Leading-edge 3D NAND Memory Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Leading-edge 3D NAND Memory Comparison 2018
Device type
Published
04/12/2018
Product Code
SP18422
Applications
Mobile & Consumer
Flyer Sample

Wafer to Wafer Permanent Bonding Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Wafer Permanent Bonding Comparison 2018
Device type
Published
20/11/2018
Product Code
18430
Applications
Automotive & Mobility Industrial Mobile & Consumer
Flyer Sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
Published
06/06/2018
Product Code
SP18406
Applications
Mobile & Consumer
Flyer Sample
NVIDIA Tesla P100 Graphics Processing Unit (GPU) with HBM2 - TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging - System Plus Consulting

NVIDIA Tesla P100 GPU with HBM2

Report type
Reverse Costing
Manufacturer
NVIDIA
Reference
NVIDIA Tesla
Device type
Published
18/10/2017
Product Code
SP17353
Applications
Mobile & Consumer
Flyer Sample
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