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3D NAND Memory Comparison 2021 - Samsung’s 128-layer Die cross section - System Plus Consulting

3D NAND Memory Comparison 2021

Report type
Reverse Costing
Manufacturer
Intel, Samsung, SK hynix
Reference
3D NAND
Device type
Published
25/11/2021
Product Code
SPR21528
Applications
Mobile & Consumer
Flyer Sample
Apple’s A15 Bionic System-on-Chip - Apple A15 SoC Package - System Plus Consulting

Apple’s A15 Bionic System-on-Chip

Report type
Reverse Costing
Manufacturer
Apple
Reference
A15
Device type
Published
23/11/2021
Product Code
SPR21607
Applications
Mobile & Consumer
Flyer Sample
Apple’s A14 Bionic System-on-Chip - Apple A14 SoC Package - System Plus Consulting

Apple’s A14 Bionic System-on-Chip

Report type
Reverse Costing
Manufacturer
Apple
Reference
A14
Device type
Published
23/11/2021
Product Code
SPR21629
Applications
Mobile & Consumer
Flyer Sample

Samsung 128-layer V-NAND Memory

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Device type
Published
04/11/2021
Product Code
SPR21584
Applications
Mobile & Consumer
Flyer Sample
Intel 144 layer 3D NAND Memory - Memory Die Staircase Region - System Plus Consulting

Intel 144-layer 3D NAND Memory

Report type
Reverse Costing
Manufacturer
Intel
Reference
Device type
Published
03/11/2021
Product Code
SPR21616
Applications
Mobile & Consumer Telecom & Infrastructure
Flyer Sample
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