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DENSO SiC Power Module in Toyota Mirai II - Package Opening tilted – Optical View - System Plus Consulting

DENSO SiC Power Module in the Toyota Mirai II

Report type
Reverse Costing
Manufacturer
Denso
Reference
Device type
Published
15/12/2021
Product Code
SPR21627
Applications
Automotive & Mobility
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Samsung 16Gb LPDDR5 1z DRAM Memory -Samsung LPDDR5 Die Cross Section - System Plus Consulting

Samsung 16Gb LPDDR5 1z DRAM Memory

Report type
Reverse Costing
Manufacturer
Samsung
Reference
K3LK7K7OBM
Device type
Published
09/12/2021
Product Code
SPR21618
Applications
Mobile & Consumer
Flyer Sample
3D NAND Memory Comparison 2021 - Samsung’s 128-layer Die cross section - System Plus Consulting

3D NAND Memory Comparison 2021

Report type
Reverse Costing
Manufacturer
Intel, Samsung, SK hynix
Reference
3D NAND
Device type
Published
25/11/2021
Product Code
SPR21528
Applications
Mobile & Consumer
Flyer Sample
Apple’s A15 Bionic System-on-Chip - Apple A15 SoC Package - System Plus Consulting

Apple’s A15 Bionic System-on-Chip

Report type
Reverse Costing
Manufacturer
Apple
Reference
A15
Device type
Published
23/11/2021
Product Code
SPR21607
Applications
Mobile & Consumer
Flyer Sample
Apple’s A14 Bionic System-on-Chip - Apple A14 SoC Package - System Plus Consulting

Apple’s A14 Bionic System-on-Chip

Report type
Reverse Costing
Manufacturer
Apple
Reference
A14
Device type
Published
23/11/2021
Product Code
SPR21629
Applications
Mobile & Consumer
Flyer Sample
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