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Package Cross Section - System Plus Consulting

Qualcomm Snapdragon 888 System on Chip with 5G Modem

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Snapdragon 888
Device type
Published
19/05/2021
Product Code
SPR21612
Applications
Mobile & Consumer
Flyer Sample
Oppo Reno3 5G Sub-6 Front-End Module - Analyzed Die - System Plus Consulting

Oppo Reno3 5G Sub-6 Front-End Modules

Report type
Reverse Costing
Manufacturer
Oppo, Qorvo, Skyworks
Reference
Oppo Reno3
Device type
Published
06/05/2021
Product Code
SPR21624
Applications
Mobile & Consumer
Flyer Sample
RFFEM Technical & Cost Comparison 2021 - 5G Chipset - Component Observation - System Plus Consulting

RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset

Report type
Reverse Costing
Manufacturer
Apple, Huawei, LG, Meizu, OnePlus, RealMe, Samsung, Sharp, Xiaomi, ZTE
Reference
RFFEM
Device type
Published
01/04/2021
Product Code
SPR21530
Applications
Mobile & Consumer
Flyer Sample
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple - Contents Overview – iPhone SE & iPhone 12 - System Plus Consulting

RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple

Report type
Manufacturer
Apple
Reference
Apple
Device type
Published
04/03/2021
Product Code
SPR21588
Applications
Mobile & Consumer
Flyer Sample
Broadcom AFEM8200 MBHB PAMiD - Content Overview - System Plus

Broadcom AFEM-8200 PAMiD in the Apple iPhone 12 Series

Report type
Manufacturer
Apple, Avago, Broadcom
Reference
AFEM-8200 PAMiD
Device type
Published
25/02/2021
Product Code
SPR21606
Applications
Mobile & Consumer
Flyer Sample
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