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GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S, GaN Systems
Reference
GS66508T
Device type
Embedded, GaN,
Published
08/10/2015
Product Code
SP15233
Applications
Industrial
Available flyer Available sample

Transphorm TPH3002PS

Report type
Reverse Costing
Manufacturer
Transphorm
Reference
TPH3002PS
Device type
GaN,
Published
07/05/2015
Product Code
SP15216
Applications
Available flyer Available sample

GaN Systems GS66508P 650V HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GS66508P
Device type
Embedded, GaN,
Published
08/01/2015
Product Code
SP15202
Applications
Available flyer Available sample

GaN Systems HEMT Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S
Reference
GS66508P
Device type
Embedded, GaN,
Published
15/01/2015
Product Code
RS202
Applications
Industrial
Available flyer Available sample

EPC – 2010 GaN 200V power transistor

Report type
Reverse Costing
Manufacturer
EPC Corporation
Reference
2010
Device type
GaN,
Published
06/12/2011
Product Code
SP11075
Applications
Available flyer Available sample
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