Follow us :

Power Module Packaging 2018: Material Market and Technology Trends

Report type
Manufacturer
Infineon, Intel, Mitsubishi, Semikron, STMicroelectronics
Reference
Power Module Packaging 2018
Device type
Published
26/07/2018
Product Code
YD18032
Applications
Flyer Sample

Automotive Power Module Packaging Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Bosch, Infineon, Mitsubishi, Semikron, STMicroelectronics, Toshiba, Toyota
Reference
Automotive Power Module Packaging
Device type
Published
11/07/2018
Product Code
SP18399
Applications
Automotive
Flyer Sample
Power Discrete Packaging Comparison 2018: A cost-oriented overview of evolutionary trends in power discrete packages, from mW to kW - System Plus Consulting

Power Discrete Packaging Comparison 2018

Report type
Reverse Costing
Manufacturer
Reference
Power Discrete Packaging
Device type
Published
09/05/2018
Product Code
SP18359
Applications
Automotive Consumer Industrial
Flyer Sample
Infineon FF400R07A01E3 Double Side Cooled IGBT Module: discover Infineon‘s first double sided cooling power module for automotive - System Plus Consulting

Infineon FF400R07A01E3 Double Side Cooled IGBT Module

Report type
Reverse Costing
Manufacturer
Infineon
Reference
Infineon FF400R07A01E3
Device type
Published
23/01/2018
Product Code
SP18375
Applications
Automotive
Flyer Sample
Wolfspeed C2M 1200V SiC MOSFET C2M0025120D: Cree’s crucial role in strategic choices for medium voltage SiC MOSFETs - System Plus Consulting

Wolfspeed C2M 1200V SiC MOSFET C2M0025120D

Report type
Manufacturer
Wolfspeed
Reference
wolfspeed MOSFET SiC
Device type
Published
10/01/2018
Product Code
SP18380
Applications
Consumer Industrial
Flyer Sample
© Copyright 2021 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions