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DENSO SiC Power Module in Toyota Mirai II - Package Opening tilted – Optical View - System Plus Consulting

DENSO SiC Power Module in the Toyota Mirai II

Report type
Reverse Costing
Manufacturer
Denso
Reference
Device type
Published
15/12/2021
Product Code
SPR21627
Applications
Automotive & Mobility
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SiC Transistor Comparison 2021 - Package Opening – Die Topsides – Optical View - System Plus Consulting

SiC Transistor Comparison 2021

Report type
Reverse Costing
Manufacturer
Reference
Device type
Published
15/12/2021
Product Code
SPR21604
Applications
Automotive & Mobility Industrial Telecom & Infrastructure
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Infineon EiceDRIVER gate driver 1EDI3020AS - LDMOS Transistor - System Plus Consulting

Infineon EiceDRIVER Gate Driver 1EDI3020AS

Report type
Reverse Costing
Manufacturer
Infineon
Reference
1EDI3020AS
Device type
Published
09/11/2021
Product Code
SPR21628
Applications
Automotive & Mobility Industrial
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Discrete Power Device Packaging Comparison - Packaging design in descrete power devices - System Plus Consulting

Discrete Power Device Packaging Comparison 2021

Report type
Reverse Costing
Manufacturer
Infineon, Littelfuse, Microship, Nexperia, Nuvoton, ON Semiconductor, Rohm, STMicroelectronics, Taiwan Semiconductor, Texas Instrument, Toshiba, Vishay
Reference
Device type
Published
28/10/2021
Product Code
SPR21596
Applications
Automotive & Mobility Industrial
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BCD Technology and Cost Comparison 2021 - Infineon galvanic isolation – SEM Cross-Section - System Plus Consulting

BCD Technology and Cost Comparison 2021

Report type
Reverse Costing
Manufacturer
Analog Devices, Bosch, Denso, Infineon, Littelfuse, Melexis, Mitsubishi, NXP, Renesas, Rohm, STMicroelectronics, Texas Instrument, Toshiba, Toyota, TSMC
Reference
BCD
Device type
Published
23/09/2021
Product Code
SPR21594
Applications
Automotive & Mobility Defense & Aerospace Industrial Medical Mobile & Consumer Telecom & Infrastructure
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