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GaN Systems GS61004B GaN HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GaN Systems GS61004B GaN HEMT
Device type
3D Packaging, GaN,
Published
06/06/2018
Product Code
SP18391
Applications
Automotive Consumer Industrial
Available flyer Available sample
Power Discrete Packaging Comparison 2018: A cost-oriented overview of evolutionary trends in power discrete packages, from mW to kW - System Plus Consulting

Power Discrete Packaging Comparison 2018

Report type
Reverse Costing
Manufacturer
Reference
Power Discrete Packaging
Device type
IGBT, MOSFET,
Published
09/05/2018
Product Code
SP18359
Applications
Automotive Consumer Industrial
Available flyer Available sample

Littelfuse Silicon Carbide MOSFET LSIC1MO120E0080: 1200V 25A 80mOhms

Report type
Reverse Costing
Manufacturer
Littelfuse
Reference
Littelfuse SiC MOSFET LCIS1MO120E0080
Device type
SiC
Published
11/04/2018
Product Code
SP18390
Applications
Automotive Consumer Industrial
Available flyer Available sample
GaN on Silicon Transistor Comparison 2018: technology and cost of GaN-on-Si HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments - by System Plus Consulting

GaN-on-Silicon Transistor Comparison 2018

Report type
Manufacturer
EPC Corporation, GaN Systems, Panasonic, Texas Instrument, Transphorm
Reference
GaN
Device type
Embedded, GaN,
Published
04/04/2018
Product Code
SP18365
Applications
Consumer Industrial
Available flyer Available sample

Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

Report type
Market & Technology Report
Manufacturer
Apple, AT&S, EPC Corporation, Fairchild, Fuji Electric, GaN Systems, Infineon, LG, NXP, ON Semiconductor, Panasonic, Qualcomm, Samsung, Sharp, STMicroelectronics, Texas Instrument, Toshiba, Toyota, Transphorm, TSMC
Reference
Power GaN
Device type
GaN, Market report,
Published
30/11/2017
Product Code
YDPE17044
Applications
Automotive Consumer Industrial
Available flyer Available sample
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