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GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S, GaN Systems
Reference
GS66508T
Device type
Embedded, GaN,
Published
08/10/2015
Product Code
SP15233
Applications
Industrial
Available flyer Available sample

SEMIKRON SKiM306GD12E4

Report type
Reverse Costing
Manufacturer
Semikron
Reference
SKiM306GD12E4
Device type
IGBT,
Published
03/09/2015
Product Code
SP15232
Applications
Available flyer Available sample

Transphorm TPH3002PS

Report type
Reverse Costing
Manufacturer
Transphorm
Reference
TPH3002PS
Device type
GaN,
Published
07/05/2015
Product Code
SP15216
Applications
Available flyer Available sample

CREE 1700V SiC Module

Report type
Reverse Costing
Manufacturer
Cree
Reference
CAS300M17BM2
Device type
SiC
Published
19/03/2015
Product Code
SP15213
Applications
Available flyer Available sample

CREE 1200V SiC Module

Report type
Reverse Costing
Manufacturer
Cree
Reference
CAS120M12BM2
Device type
SiC
Published
19/02/2015
Product Code
SP15206
Applications
Available flyer Available sample
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