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Bonding and Lithography Equipment Market for More than Moore Devices

Report type
Market & Technology Report
Manufacturer
Reference
Bonding and Lithography Equipment Market for More than Moore Devices
Device type
Published
21/11/2018
Product Code
YD18038
Applications
Industrial
Available flyer Available sample

Qorvo QPF4006 39GHz GaN MMIC Front End Module

Report type
Reverse CostingReverse Technology
Manufacturer
Qorvo
Reference
Qorvo QPF4006 39GHz GaN MMIC Front End Module
Device type
GaN, SiC
Published
30/10/2018
Product Code
SP18411
Applications
Consumer Industrial
Available flyer Available sample

Mitsubishi J1- Series 650V High-Power Modules for Automotive

Report type
Reverse CostingReverse Technology
Manufacturer
Mitsubishi
Reference
Mitsubishi J1- Series 650V High-Power Modules for Automotive
Device type
IGBT, Si Diode
Published
10/10/2018
Product Code
SP18408
Applications
Automotive Industrial
Available flyer Available sample

1200V Silicon IGBT vs SiC MOSFET Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
1200V Si IGBT vs SiC MOSFET Comparison 2018
Device type
IGBT, MOSFET, SiC
Published
26/09/2018
Product Code
SP18388
Applications
Automotive Consumer Industrial
Available flyer Available sample

Rohm SiC MOSFET Gen3 Trench Design Family

Report type
Reverse CostingReverse Technology
Manufacturer
Rohm
Reference
Rohm SiC MOSFET Gen3 Trench Design Family
Device type
SiC
Published
14/08/2018
Product Code
SP18428
Applications
Automotive Industrial
Available flyer Available sample
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