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MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
Published
25/10/2017
Product Code
SP17352
Applications
Automotive & Mobility Mobile & Consumer
Sample Flyer
NVIDIA Tesla P100 Graphics Processing Unit (GPU) with HBM2 - TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging - System Plus Consulting

NVIDIA Tesla P100 GPU with HBM2

Report type
Reverse Costing
Manufacturer
NVIDIA
Reference
NVIDIA Tesla
Device type
Published
18/10/2017
Product Code
SP17353
Applications
Mobile & Consumer
Sample Flyer
Silicon capacitor: Discover differences between technologies from TSMC, Skyworks, Murata / IPDiA and Vishay, their related costs - System Plus Consulting

Silicon Capacitor Technology and Cost Review

Report type
Reverse Costing
Manufacturer
Murata, Skyworks, TSMC, Vishay
Reference
Silicon Capacitor
Device type
Published
19/09/2017
Product Code
SP17344
Applications
Medical Mobile & Consumer
Sample Flyer
Sony IMX400 impressive, industry-first Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP - System Plus Consulting

Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP

Report type
Reverse Costing
Manufacturer
SONY
Reference
Sony IMX400
Device type
Published
19/07/2017
Product Code
SP17343
Applications
Mobile & Consumer
Sample Flyer

TDK SESUB Bluetooth Module

Report type
Reverse Costing
Manufacturer
TDK
Reference
TDK SESUB
Device type
Published
21/06/2017
Product Code
SP17306
Applications
Mobile & Consumer
Sample Flyer
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