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Advanced RF System-in-Package for Cell Phones 2017: 5G mmWave, 5G sub 6 GHz - which packaging architectures can rise to the occasion? - Yole Développement

Advanced RF System-in-Package for Cell Phones Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
RF SiP
Device type
Market report, RF IC, SIP
Published
15/11/2017
Product Code
YDAP17041
Applications
Consumer
Available flyer Available sample
Sony IMX400 impressive, industry-first Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP - System Plus Consulting

Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP

Report type
Reverse Costing
Manufacturer
SONY
Reference
Sony IMX400
Device type
3D Packaging, Visible
Published
19/07/2017
Product Code
SP17343
Applications
Consumer
Available flyer Available sample

TDK SESUB Bluetooth Module

Report type
Reverse Costing
Manufacturer
TDK
Reference
TDK SESUB
Device type
Embedded,
Published
21/06/2017
Product Code
SP17306
Applications
Consumer
Available flyer Available sample
NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/06/2017
Product Code
SP17339
Applications
Consumer Industrial
Available flyer Available sample

Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Available flyer Available sample
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