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Deep Trench Capcitors as land-side decoupling capacitors and IPD technology from TSMC used for Apple’s A10 application processor - System Plus Consulting

TSMC Deep Trench Capacitor

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC DTC
Device type
Published
18/10/2016
Product Code
SP16300
Applications
Mobile & Consumer
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New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
Published
18/10/2016
Product Code
SP16290
Applications
Mobile & Consumer
Flyer Sample
Intel® Curie™ Module High Density System-in-Package for IoT, Ultra-small, low-power hardware module for wearables - System Plus Consulting

Intel® Curie™ Module – SiP

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Curie
Device type
Published
27/07/2016
Product Code
SP16277
Applications
Mobile & Consumer
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Qualcomm Snapdragon 820 MCeP Pop Embedded die System Plus Consulting

Qualcomm Snapdragon 820 & Samsung Exynos 8 PoP

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm Snapdragon 820
Device type
Published
14/06/2016
Product Code
SP16276
Applications
Mobile & Consumer
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Infineon RRN7745P & RTN7735P eWLB Fan-Out Package – 77GHz Radar Dies

Report type
Reverse Costing
Manufacturer
Infineon
Reference
Infineon RRN7745P & RTN7735P 77GHz Radar
Device type
Published
22/10/2015
Product Code
SP15235
Applications
Automotive & Mobility
Flyer Sample
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