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Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
Published
16/10/2018
Product Code
SP18417
Applications
Mobile & Consumer
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Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
Published
06/06/2018
Product Code
SP18406
Applications
Mobile & Consumer
Sample Flyer

Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X

Report type
Reverse Costing
Manufacturer
TSMC
Reference
Apple A11 inFO-PoP
Device type
Published
07/02/2018
Product Code
SP18373
Applications
Mobile & Consumer
Sample Flyer
AMD Radeon Vega Frontier New GPU with Samsung 8-Hi second generation high bandwidth memory and 2.5D chip-on-wafer packaging from SPIL

AMD Radeon Vega Frontier Edition

Report type
Reverse Costing
Manufacturer
AMD
Reference
AMD Readon
Device type
Published
22/11/2017
Product Code
SP17360
Applications
Mobile & Consumer
Sample Flyer
Advanced RF SiPs for Cellphones: Reverse Costing Overview from Skyworks, Murata, TDK-Epcos, Qorvo & Broadcom/Avago - System Pus Consulting

Advanced RF SiPs for Cell Phones: Reverse Costing Overview

Report type
Reverse Costing
Manufacturer
Avago, Broadcom, Murata, Qorvo, Skyworks, TDK
Reference
RF SiP
Device type
Published
15/11/2017
Product Code
SP17364
Applications
Mobile & Consumer
Sample Flyer
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