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AMD Radeon Vega Frontier New GPU with Samsung 8-Hi second generation high bandwidth memory and 2.5D chip-on-wafer packaging from SPIL

AMD Radeon Vega Frontier Edition

Report type
Reverse Costing
Manufacturer
AMD
Reference
AMD Readon
Device type
3D Packaging,
Published
22/11/2017
Product Code
SP17360
Applications
Consumer
Available flyer Available sample
Advanced RF SiPs for Cellphones: Reverse Costing Overview from Skyworks, Murata, TDK-Epcos, Qorvo & Broadcom/Avago - System Pus Consulting

Advanced RF SiPs for Cell Phones: Reverse Costing Overview

Report type
Reverse Costing
Manufacturer
Avago, Broadcom, Murata, Qorvo, Skyworks, TDK
Reference
RF SiP
Device type
RF IC, SIP
Published
15/11/2017
Product Code
SP17364
Applications
Consumer
Available flyer Available sample
Apple iPhone X: IR dot projector for 3D sensing with 4 innovative parts: package; dedicated VCSEL; folded optic; active DOE - System Plus Consulting

Apple iPhone X – Infrared Dot Projector

Report type
Reverse Costing
Manufacturer
Apple
Reference
Dot Projector
Device type
Infrared, LED Lamp, Telecom, WLP
Published
14/12/2017
Product Code
SP17376
Applications
Consumer
Available flyer Available sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

Market Opportunities for Thermal Management Components in Smartphones

Report type
Market & Technology Report
Manufacturer
Reference
Thermal market
Device type
Market report,
Published
21/11/2017
Product Code
YDPE17051
Applications
Consumer
Available flyer Available sample
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