Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
- Report type
- Reverse Technology
- Manufacturer
- Reference
- Peraso X710 CHipset
- Device type
- RF IC, SIP
- Published
- 01/08/2018
- Product Code
- SP18418
- Applications
- Consumer
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Power Module Packaging 2018: Material Market and Technology Trends
- Report type
- Manufacturer
- Infineon, Intel, Mitsubishi, Semikron, STMicroelectronics
- Reference
- Power Module Packaging 2018
- Device type
- Published
- 26/07/2018
- Product Code
- YD18032
- Applications
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition
- Report type
- Reverse Costing
- Manufacturer
- Qualcomm
- Reference
- Qualcomm WiGig Chipset Smartphone Edition
- Device type
- 3D Packaging, RF IC
- Published
- 03/07/2018
- Product Code
- SP18393
- Applications
- Consumer
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics
- Report type
- Reverse Costing
- Manufacturer
- STMicroelectronics
- Reference
- STMicroelectronics SiC
- Device type
- SiC
- Published
- 21/06/2018
- Product Code
- SP18413
- Applications
- Automotive
Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP
- Report type
- Reverse Costing
- Manufacturer
- Qualcomm, Samsung
- Reference
- Processor Packages
- Device type
- 3D Packaging, Embedded,
- Published
- 06/06/2018
- Product Code
- SP18406
- Applications
- Consumer