Oppo Find X Teardown and Identification of Key Components
- Report type
- Reverse Technology
- Manufacturer
- Oppo
- Reference
- Oppo Find X Teardown
- Device type
- Published
- 23/10/2018
- Product Code
- SP18435
- Applications
- Consumer
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Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)
- Report type
- Reverse Costing
- Manufacturer
- Samsung
- Reference
- Exynos 9110
- Device type
- 3D Packaging, Embedded, SIP, WLP
- Published
- 14/11/2018
- Product Code
- SP18444
- Applications
- Consumer
Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
- Report type
- Reverse CostingReverse Technology
- Manufacturer
- Intel
- Reference
- Intel’s EMIB
- Device type
- 3D Packaging, Embedded,
- Published
- 16/10/2018
- Product Code
- SP18417
- Applications
- Consumer
Mitsubishi J1- Series 650V High-Power Modules for Automotive
- Report type
- Reverse CostingReverse Technology
- Manufacturer
- Mitsubishi
- Reference
- Mitsubishi J1- Series 650V High-Power Modules for Automotive
- Device type
- IGBT, Si Diode
- Published
- 10/10/2018
- Product Code
- SP18408
- Applications
- Automotive Industrial
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
- Report type
- Reverse Technology
- Manufacturer
- Reference
- Peraso X710 CHipset
- Device type
- RF IC, SIP
- Published
- 01/08/2018
- Product Code
- SP18418
- Applications
- Consumer