Samsung Galaxy S9+ Teardown and Identification of Key Components
- Report type
- Reverse TechnologySystem
- Manufacturer
- Samsung
- Reference
- Samsung S9+
- Device type
- Telecom, WLP
- Published
- 28/03/2018
- Product Code
- SP18402
- Applications
- Consumer
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Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X
- Report type
- Reverse Costing
- Manufacturer
- TSMC
- Reference
- Apple A11 inFO-PoP
- Device type
- 3D Packaging,
- Published
- 07/02/2018
- Product Code
- SP18373
- Applications
- Consumer
Infineon FF400R07A01E3 Double Side Cooled IGBT Module
- Report type
- Reverse Costing
- Manufacturer
- Infineon
- Reference
- Infineon FF400R07A01E3
- Device type
- IGBT,
- Published
- 23/01/2018
- Product Code
- SP18375
- Applications
- Automotive
Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band
- Report type
- Reverse Costing
- Manufacturer
- Qualcomm
- Reference
- Qualcomm QCA9500 WiGig Chipset
- Device type
- 3D Packaging, RF IC, SIP
- Published
- 17/01/2018
- Product Code
- SP18374
- Applications
- Automotive Consumer Industrial
Thermal Management in Smartphones: Technology Comparison 2017
- Report type
- Reverse Technology
- Manufacturer
- Apple, Huawei, LG, Samsung, Xiaomi
- Reference
- Thermal Management
- Device type
- Published
- 29/11/2017
- Product Code
- SP17369
- Applications
- Consumer