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Leading-edge 3D NAND Memory Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Leading-edge 3D NAND Memory Comparison 2018
Device type
Published
04/12/2018
Product Code
SP18422
Applications
Mobile & Consumer
Flyer Sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
Published
14/11/2018
Product Code
SP18444
Applications
Mobile & Consumer
Flyer Sample

Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
Published
16/10/2018
Product Code
SP18417
Applications
Mobile & Consumer
Flyer Sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
Published
06/06/2018
Product Code
SP18406
Applications
Mobile & Consumer
Flyer Sample

Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X

Report type
Reverse Costing
Manufacturer
TSMC
Reference
Apple A11 inFO-PoP
Device type
Published
07/02/2018
Product Code
SP18373
Applications
Mobile & Consumer
Flyer Sample
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