Infineon FF400R07A01E3 Double Side Cooled IGBT Module
- Report type
- Reverse Costing
- Manufacturer
- Infineon
- Reference
- Infineon FF400R07A01E3
- Device type
- IGBT,
- Published
- 23/01/2018
- Product Code
- SP18375
- Applications
- Automotive
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Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band
- Report type
- Reverse Costing
- Manufacturer
- Qualcomm
- Reference
- Qualcomm QCA9500 WiGig Chipset
- Device type
- 3D Packaging, RF IC, SIP
- Published
- 17/01/2018
- Product Code
- SP18374
- Applications
- Automotive Consumer Industrial
Thermal Management in Smartphones: Technology Comparison 2017
- Report type
- Reverse Technology
- Manufacturer
- Apple, Huawei, LG, Samsung, Xiaomi
- Reference
- Thermal Management
- Device type
- Published
- 29/11/2017
- Product Code
- SP17369
- Applications
- Consumer
AMD Radeon Vega Frontier Edition
- Report type
- Reverse Costing
- Manufacturer
- AMD
- Reference
- AMD Readon
- Device type
- 3D Packaging,
- Published
- 22/11/2017
- Product Code
- SP17360
- Applications
- Consumer
Advanced RF SiPs for Cell Phones: Reverse Costing Overview
- Report type
- Reverse Costing
- Manufacturer
- Avago, Broadcom, Murata, Qorvo, Skyworks, TDK
- Reference
- RF SiP
- Device type
- RF IC, SIP
- Published
- 15/11/2017
- Product Code
- SP17364
- Applications
- Consumer