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Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics - Yole Développement

Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics

Report type
Market & Technology Report
Manufacturer
AAC Technologies, Alps, Apple, Continental, Fujitsu, Google, Huawei, Intel, Lenovo, LG, Mobileye, Omnivision, ON Semiconductor, Panasonic, Parrot, Samsung, Sharp, SONY, STMicroelectronics, TDK, Toshiba, Valeo, Xiaomi, ZTE
Reference
Yole Développement Report
Device type
Market report, Visible
Published
28/02/2019
Product Code
YD19006
Applications
Automotive Consumer Industrial Medical
Available flyer Available sample
SP19445-Broadcom AFEM-8092_2

Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series

Report type
Reverse CostingReverse Technology
Manufacturer
Broadcom
Reference
Broadcom AFEM-8092
Device type
RF IC, SIP
Published
20/02/2019
Product Code
SP19445
Applications
Consumer
Available flyer Available sample

Wolfspeed CAS325M12HM2 All-SiC 1200V Power Module

Report type
Reverse CostingReverse Technology
Manufacturer
Wolfspeed
Reference
Wolfspeed CAS325M12HM2 1200V SiC Module
Device type
MOSFET, SiC
Published
13/02/2019
Product Code
SP19416
Applications
Industrial
Available flyer Available sample
Satuts_CIS_2018_image_cover

Status of the CMOS Image Sensor Industry 2018

Report type
Market & Technology Report
Manufacturer
Reference
Status of CIS 2018
Device type
Photonics
Published
21/09/2018
Product Code
YD18035
Applications
Automotive Consumer Industrial Medical
Available flyer Available sample

Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type
Reverse CostingReverse Technology
Manufacturer
Apple
Reference
Apple Watch S4 SiP
Device type
3D Packaging, Embedded, SIP
Published
23/01/2019
Product Code
SP19439
Applications
Consumer
Available flyer Available sample
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