PACKAGING Archives - Page 5 of 16 - System Plus Consulting

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Since 1993, System Plus Consulting engineers have been analyzing
and modeling the production cost and selling price of integrated circuits,
electronic boards and systems.

Reverse costing

Technology analysis

Available reports

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SP19445-Broadcom AFEM-8092_2

Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series

Report type: Reverse CostingReverse Technology
Manufacturer: Broadcom
Reference: Broadcom AFEM-8092

Device type: RF IC, SIP
Published: 20/02/2019
Product Code: SP19445
Applications: Consumer

Available flyer Available sample

Wolfspeed CAS325M12HM2 All-SiC 1200V Power Module

Report type: Reverse CostingReverse Technology
Manufacturer: Wolfspeed
Reference: Wolfspeed CAS325M12HM2 1200V SiC Module

Device type: MOSFET, SiC
Published: 13/02/2019
Product Code: SP19416
Applications: Industrial

Available flyer Available sample

Satuts_CIS_2018_image_cover

Status of the CMOS Image Sensor Industry 2018

Report type: Market & Technology Report
Manufacturer
Reference: Status of CIS 2018

Device type: Photonics
Published: 21/09/2018
Product Code: YD18035
Applications: Automotive Consumer Industrial Medical

Available flyer Available sample

Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type: Reverse CostingReverse Technology
Manufacturer: Apple
Reference: Apple Watch S4 SiP

Device type: 3D Packaging, Embedded, SIP
Published: 23/01/2019
Product Code: SP19439
Applications: Consumer

Available flyer Available sample

Ainstein K-77 Long Range Radar featuring Calterah CAL77A2T4R FOWLP Transceiver

Report type: Reverse CostingReverse Technology
Manufacturer: Ainstein, Calterah
Reference: Ainstein K-77 Radar & Calterah CAL77A2T4R

Device type: RF IC, WLP
Published: 09/01/2019
Product Code: SP19400
Applications: Automotive

Available flyer Available sample

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