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Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Available flyer Available sample

GaN Systems GS61004B GaN HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GaN Systems GS61004B GaN HEMT
Device type
3D Packaging, GaN,
Published
06/06/2018
Product Code
SP18391
Applications
Automotive Consumer Industrial
Available flyer Available sample
Apple iPhone X teardown, identifaction of key devices, advanced packaging technical choices and main suppliers - System Plus Consulting

Apple iPhone X Teardown and Identification of Key Components

Report type
Reverse Technology
Manufacturer
Apple
Reference
Apple iPhone X
Device type
Reverse Technology
Published
23/05/2018
Product Code
SP18409
Applications
Automotive Consumer
Available flyer Available sample
Huawei P20 Pro Teardown, identifaction of key devices, advanced packaging technical choices and main suppliers - System Plus Consulting

Huawei P20 Pro Teardown and Identification of Key Components

Report type
Reverse Technology
Manufacturer
Huawei
Reference
Huawei P20 Pro
Device type
Reverse Technology
Published
23/05/2018
Product Code
SP18412
Applications
Automotive Consumer
Available flyer Available sample
GaN on Silicon Transistor Comparison 2018: technology and cost of GaN-on-Si HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments - by System Plus Consulting

GaN-on-Silicon Transistor Comparison 2018

Report type
Manufacturer
EPC Corporation, GaN Systems, Panasonic, Texas Instrument, Transphorm
Reference
GaN
Device type
Embedded, GaN,
Published
04/04/2018
Product Code
SP18365
Applications
Consumer Industrial
Available flyer Available sample
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