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Available reports ( 487 )

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Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type
Reverse CostingReverse Technology
Manufacturer
Apple
Reference
Apple Watch S4 SiP
Device type
Published
23/01/2019
Product Code
SP19439
Applications
Mobile & Consumer
Flyer Sample

Leading-edge 3D NAND Memory Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Leading-edge 3D NAND Memory Comparison 2018
Device type
Published
04/12/2018
Product Code
SP18422
Applications
Mobile & Consumer
Flyer Sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
Published
14/11/2018
Product Code
SP18444
Applications
Mobile & Consumer
Flyer Sample

Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
Published
16/10/2018
Product Code
SP18417
Applications
Mobile & Consumer
Flyer Sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
Published
06/06/2018
Product Code
SP18406
Applications
Mobile & Consumer
Flyer Sample
Corporate Brochure
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