Advanced System-in-Package Technology in Apple’s AirPods Pro
- Report type
- Reverse Costing
- Manufacturer
- Apple
- Reference
- Apple AirPods Pro audio codec module
- Device type
- Published
- 11/03/2020
- Product Code
- SP20471
- Applications
- Mobile & Consumer
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Fan-Out Packaging Processes Comparison 2020
- Report type
- Reverse Costing
- Manufacturer
- Reference
- Fan-Out Packaging Processes Comparison 2020
- Device type
- Published
- 04/02/2020
- Product Code
- SP20479
- Applications
- Automotive & Mobility Industrial Mobile & Consumer
RF Front-End Module Comparison 2020 – Volume 1
- Report type
- Reverse Costing
- Manufacturer
- Apple, Samsung
- Reference
- RF Front-End Module Comparison 2020 V1
- Device type
- Published
- 29/01/2020
- Product Code
- SP20504
- Applications
- Mobile & Consumer
Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology
- Report type
- Reverse Costing
- Manufacturer
- Qualcomm
- Reference
- Qualcomm QET5100M Envelope Tracker Module
- Device type
- Published
- 06/11/2019
- Product Code
- SP19425
- Applications
- Mobile & Consumer
ASE/Deca M-Series Fan-Out Process
- Report type
- Reverse CostingReverse Technology
- Manufacturer
- ASE, Deca Technologies, Qualcomm
- Reference
- ASE/Deca M-Series Fan-Out Process
- Device type
- Published
- 25/09/2019
- Product Code
- SP19486
- Applications
- Mobile & Consumer