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AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
Published
11/03/2020
Product Code
SP20471
Applications
Mobile & Consumer
Flyer Sample
SP20479-Fan-Out Packaging Processes Comparison 2020_1

Fan-Out Packaging Processes Comparison 2020

Report type
Reverse Costing
Manufacturer
Reference
Fan-Out Packaging Processes Comparison 2020
Device type
Published
04/02/2020
Product Code
SP20479
Applications
Automotive & Mobility Industrial Mobile & Consumer
Flyer Sample
SP20504 - RFFEM Comparison 2020 Vol1_1

RF Front-End Module Comparison 2020 – Volume 1

Report type
Reverse Costing
Manufacturer
Apple, Samsung
Reference
RF Front-End Module Comparison 2020 V1
Device type
Published
29/01/2020
Product Code
SP20504
Applications
Mobile & Consumer
Flyer Sample
SP19425 - SEMCO Embedded Die in Qualcomm QET5100M_1

Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QET5100M Envelope Tracker Module
Device type
Published
06/11/2019
Product Code
SP19425
Applications
Mobile & Consumer
Flyer Sample
SP19486- ASE-Deca M-Series Fan-Out Process_1

ASE/Deca M-Series Fan-Out Process

Report type
Reverse CostingReverse Technology
Manufacturer
ASE, Deca Technologies, Qualcomm
Reference
ASE/Deca M-Series Fan-Out Process
Device type
Published
25/09/2019
Product Code
SP19486
Applications
Mobile & Consumer
Flyer Sample
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