Apple iPhone X Teardown and Identification of Key Components
- Report type
- Reverse Technology
- Manufacturer
- Apple
- Reference
- Apple iPhone X
- Device type
- Reverse Technology
- Published
- 23/05/2018
- Product Code
- SP18409
- Applications
- Automotive Consumer
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Huawei P20 Pro Teardown and Identification of Key Components
- Report type
- Reverse Technology
- Manufacturer
- Huawei
- Reference
- Huawei P20 Pro
- Device type
- Reverse Technology
- Published
- 23/05/2018
- Product Code
- SP18412
- Applications
- Automotive Consumer
GaN-on-Silicon Transistor Comparison 2018
- Report type
- Manufacturer
- EPC Corporation, GaN Systems, Panasonic, Texas Instrument, Transphorm
- Reference
- GaN
- Device type
- Embedded, GaN,
- Published
- 04/04/2018
- Product Code
- SP18365
- Applications
- Consumer Industrial
Samsung Galaxy S9+ Teardown and Identification of Key Components
- Report type
- Reverse TechnologySystem
- Manufacturer
- Samsung
- Reference
- Samsung S9+
- Device type
- Telecom, WLP
- Published
- 28/03/2018
- Product Code
- SP18402
- Applications
- Consumer
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X
- Report type
- Reverse Costing
- Manufacturer
- TSMC
- Reference
- Apple A11 inFO-PoP
- Device type
- 3D Packaging,
- Published
- 07/02/2018
- Product Code
- SP18373
- Applications
- Consumer