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Available reports ( 398 )

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Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample

Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics

Report type
Reverse Costing
Manufacturer
STMicroelectronics
Reference
STMicroelectronics SiC
Device type
SiC
Published
21/06/2018
Product Code
SP18413
Applications
Automotive
Available flyer Available sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Available flyer Available sample

GaN Systems GS61004B GaN HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GaN Systems GS61004B GaN HEMT
Device type
3D Packaging, GaN,
Published
06/06/2018
Product Code
SP18391
Applications
Automotive Consumer Industrial
Available flyer Available sample
Apple iPhone X teardown, identifaction of key devices, advanced packaging technical choices and main suppliers - System Plus Consulting

Apple iPhone X Teardown and Identification of Key Components

Report type
Reverse Technology
Manufacturer
Apple
Reference
Apple iPhone X
Device type
Reverse Technology
Published
23/05/2018
Product Code
SP18409
Applications
Automotive Consumer
Available flyer Available sample
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