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Power Module Packaging 2018: Material Market and Technology Trends

Report type
Manufacturer
Infineon, Intel, Mitsubishi, Semikron, STMicroelectronics
Reference
Power Module Packaging 2018
Device type
Published
26/07/2018
Product Code
YD18032
Applications
Available flyer Available sample

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample

Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics

Report type
Reverse Costing
Manufacturer
STMicroelectronics
Reference
STMicroelectronics SiC
Device type
SiC
Published
21/06/2018
Product Code
SP18413
Applications
Automotive
Available flyer Available sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Available flyer Available sample

GaN Systems GS61004B GaN HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GaN Systems GS61004B GaN HEMT
Device type
3D Packaging, GaN,
Published
06/06/2018
Product Code
SP18391
Applications
Automotive Consumer Industrial
Available flyer Available sample
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