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Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample

Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
3D Packaging, Embedded,
Published
16/10/2018
Product Code
SP18417
Applications
Consumer
Available flyer Available sample

Mitsubishi J1- Series 650V High-Power Modules for Automotive

Report type
Reverse CostingReverse Technology
Manufacturer
Mitsubishi
Reference
Mitsubishi J1- Series 650V High-Power Modules for Automotive
Device type
IGBT, Si Diode
Published
10/10/2018
Product Code
SP18408
Applications
Automotive Industrial
Available flyer Available sample

STMicroelectronics ToF Proximity Sensor & Flood Illuminator in the Apple iPhone X – Patent-to-Product Mapping

Report type
Patent
Manufacturer
Apple
Reference
STMicroelectronics ToF Proximity Sensor & Flood Illuminator in the Apple iPhone X - Patent-to-Product Mapping
Device type
Published
09/08/2018
Product Code
KM18006
Applications
Available flyer Available sample

Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution

Report type
Reverse Technology
Manufacturer
Reference
Peraso X710 CHipset
Device type
RF IC, SIP
Published
01/08/2018
Product Code
SP18418
Applications
Consumer
Available flyer Available sample
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