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Antenna in package Mediatek eWLP AiP Radar chipset - System Plus Consulting

Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset

Report type
Reverse Costing
Manufacturer
Mediatek
Reference
Mediatek Autus R10 (MT2706)
Device type
RF IC, WLP
Published
15/04/2020
Product Code
SP20556
Applications
Automotive
Available flyer Available sample
SP20519-CT Scan of the Antenna-on-Package

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Report type
Reverse Costing
Manufacturer
Google, Infineon, Knowles
Reference
Google Pixel 4XL Gesture Recognition
Device type
3D Packaging, RF IC, WLP
Published
08/04/2020
Product Code
SP20519
Applications
Consumer
Available flyer Available sample
AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
3D Packaging, SIP
Published
11/03/2020
Product Code
SP20471
Applications
Consumer
Available flyer Available sample
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series

Report type
Reverse Costing
Manufacturer
Broadcom
Reference
Broadcom AFEM-8100
Device type
RF IC, SIP
Published
04/03/2020
Product Code
SP20521
Applications
Consumer
Available flyer Available sample
SP20479-Fan-Out Packaging Processes Comparison 2020_1

Fan-Out Packaging Processes Comparison 2020

Report type
Reverse Costing
Manufacturer
Reference
Fan-Out Packaging Processes Comparison 2020
Device type
Embedded, SIP, WLP
Published
04/02/2020
Product Code
SP20479
Applications
Automotive Consumer Industrial
Available flyer Available sample
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