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SP20519-CT Scan of the Antenna-on-Package

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Report type
Reverse Costing
Manufacturer
Google, Infineon, Knowles
Reference
Google Pixel 4XL Gesture Recognition
Device type
3D Packaging, RF IC, WLP
Published
08/04/2020
Product Code
SP20519
Applications
Consumer
Available flyer Available sample
AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
3D Packaging, SIP
Published
11/03/2020
Product Code
SP20471
Applications
Consumer
Available flyer Available sample
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series

Report type
Reverse Costing
Manufacturer
Broadcom
Reference
Broadcom AFEM-8100
Device type
RF IC, SIP
Published
04/03/2020
Product Code
SP20521
Applications
Consumer
Available flyer Available sample
SP20479-Fan-Out Packaging Processes Comparison 2020_1

Fan-Out Packaging Processes Comparison 2020

Report type
Reverse Costing
Manufacturer
Reference
Fan-Out Packaging Processes Comparison 2020
Device type
Embedded, SIP, WLP
Published
04/02/2020
Product Code
SP20479
Applications
Automotive Consumer Industrial
Available flyer Available sample
SP20504 - RFFEM Comparison 2020 Vol1_1

RF Front-End Module Comparison 2020 – Volume 1

Report type
Reverse Costing
Manufacturer
Apple, Samsung
Reference
RF Front-End Module Comparison 2020 V1
Device type
RF IC, SIP
Published
29/01/2020
Product Code
SP20504
Applications
Consumer
Available flyer Available sample
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