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Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series

Report type
Reverse Costing
Manufacturer
Broadcom
Reference
Broadcom AFEM-8100
Device type
RF IC, SIP
Published
04/03/2020
Product Code
SP20521
Applications
Consumer
Available flyer Available sample
SP20479-Fan-Out Packaging Processes Comparison 2020_1

Fan-Out Packaging Processes Comparison 2020

Report type
Reverse Costing
Manufacturer
Reference
Fan-Out Packaging Processes Comparison 2020
Device type
Embedded, SIP, WLP
Published
04/02/2020
Product Code
SP20479
Applications
Automotive Consumer Industrial
Available flyer Available sample
SP20504 - RFFEM Comparison 2020 Vol1_1

RF Front-End Module Comparison 2020 – Volume 1

Report type
Reverse Costing
Manufacturer
Apple, Samsung
Reference
RF Front-End Module Comparison 2020 V1
Device type
RF IC, SIP
Published
29/01/2020
Product Code
SP20504
Applications
Consumer
Available flyer Available sample
SP19514 -Nvidia Tegra K1 Visual Computing Module_1

Nvidia Tegra K1 Visual Computing Module

Report type
Reverse Costing
Manufacturer
Reference
Nvidia Tegra K1 VCM
Device type
Memory, SIP
Published
17/12/2019
Product Code
SP19514
Applications
Automotive
Available flyer Available sample
SP19425 - SEMCO Embedded Die in Qualcomm QET5100M_1

Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QET5100M Envelope Tracker Module
Device type
Embedded,
Published
06/11/2019
Product Code
SP19425
Applications
Consumer
Available flyer Available sample
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