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Samsung 3D TSV – Stacked DDR4 DRAM

Report type
Reverse Costing
Manufacturer
Samsung
Reference
3D TSV
Device type
Published
07/07/2015
Product Code
SP15226
Applications
Mobile & Consumer
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TDK-EPC P8009 Module with Maxim Embedded Dies

Report type
Reverse Costing
Manufacturer
TDK
Reference
P8009
Device type
Published
05/06/2013
Product Code
SP13133
Applications
Sample Flyer

Rohm – DC/DC Micro Converter TDK-EPC Embedded Die Process

Report type
Reverse Costing
Manufacturer
Rohm
Reference
DC/DC Micro Converter
Device type
Published
22/01/2013
Product Code
SP13113
Applications
Industrial
Sample Flyer

Texas Instruments – MicroSiP™ Module Using AT&S ECP® Process

Report type
Reverse Costing
Manufacturer
Texas Instrument
Reference
MicroSiP™
Device type
Published
22/02/2012
Product Code
SP12079
Applications
Sample Flyer

Infineon X-GOLD™ 213 – eWLB Package

Report type
Reverse Costing
Manufacturer
Infineon
Reference
IFX213
Device type
Published
08/02/2010
Product Code
SP10026
Applications
Mobile & Consumer
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