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Package Cross-Section Qualcomm Fan-Out WCD9335 - System Plus Consulting

Qualcomm WCD9335

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
WCD9335
Device type
Integrated Circuit, WLP
Published
27/04/2016
Product Code
SP16267
Applications
Consumer
Available flyer Available sample

NXP MR2001

Report type
Reverse Costing
Manufacturer
NXP
Reference
MR2001
Device type
RF IC, WLP
Published
31/03/2016
Product Code
SP16263
Applications
Automotive
Available flyer Available sample

Infineon RRN7745P & RTN7735P eWLB Fan-Out Package – 77GHz Radar Dies

Report type
Reverse Costing
Manufacturer
Infineon
Reference
Infineon RRN7745P & RTN7735P 77GHz Radar
Device type
RF IC, WLP
Published
22/10/2015
Product Code
SP15235
Applications
Automotive
Available flyer Available sample

GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S, GaN Systems
Reference
GS66508T
Device type
Embedded, GaN,
Published
08/10/2015
Product Code
SP15233
Applications
Industrial
Available flyer Available sample

AMD High-Bandwidth Memory

Report type
Reverse Costing
Manufacturer
AMD
Reference
Radeon R9 Fury X
Device type
3D Packaging,
Published
10/09/2015
Product Code
SP15231
Applications
Consumer
Available flyer Available sample
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