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Intel® Curie™ Module High Density System-in-Package for IoT, Ultra-small, low-power hardware module for wearables - System Plus Consulting

Intel® Curie™ Module – SiP

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Curie
Device type
SIP
Published
27/07/2016
Product Code
SP16277
Applications
Consumer
Available flyer Available sample
Qualcomm Snapdragon 820 MCeP Pop Embedded die System Plus Consulting

Qualcomm Snapdragon 820 & Samsung Exynos 8 PoP

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm Snapdragon 820
Device type
3D Packaging,
Published
14/06/2016
Product Code
SP16276
Applications
Consumer
Available flyer Available sample
Package Cross-Section Qualcomm Fan-Out WCD9335 - System Plus Consulting

Qualcomm WCD9335

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
WCD9335
Device type
Integrated Circuit, WLP
Published
27/04/2016
Product Code
SP16267
Applications
Consumer
Available flyer Available sample

NXP MR2001

Report type
Reverse Costing
Manufacturer
NXP
Reference
MR2001
Device type
RF IC, WLP
Published
31/03/2016
Product Code
SP16263
Applications
Automotive
Available flyer Available sample

Infineon RRN7745P & RTN7735P eWLB Fan-Out Package – 77GHz Radar Dies

Report type
Reverse Costing
Manufacturer
Infineon
Reference
Infineon RRN7745P & RTN7735P 77GHz Radar
Device type
RF IC, WLP
Published
22/10/2015
Product Code
SP15235
Applications
Automotive
Available flyer Available sample
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