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Apple iPhone X: IR dot projector for 3D sensing with 4 innovative parts: package; dedicated VCSEL; folded optic; active DOE - System Plus Consulting

Apple iPhone X – Infrared Dot Projector

Report type
Reverse Costing
Manufacturer
Apple
Reference
Dot Projector
Device type
Infrared, LED Lamp, Telecom, WLP
Published
14/12/2017
Product Code
SP17376
Applications
Consumer
Flyer Sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Flyer Sample

Market Opportunities for Thermal Management Components in Smartphones

Report type
Market & Technology Report
Manufacturer
Reference
Thermal market
Device type
Market report,
Published
21/11/2017
Product Code
YDPE17051
Applications
Consumer
Flyer Sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
Market report,
Published
25/10/2017
Product Code
YDAP17045
Applications
Flyer Sample
NVIDIA Tesla P100 Graphics Processing Unit (GPU) with HBM2 - TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging - System Plus Consulting

NVIDIA Tesla P100 GPU with HBM2

Report type
Reverse Costing
Manufacturer
NVIDIA
Reference
NVIDIA Tesla
Device type
3D Packaging,
Published
18/10/2017
Product Code
SP17353
Applications
Consumer
Flyer Sample
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