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Rohm – DC/DC Micro Converter TDK-EPC Embedded Die Process

Report type
Reverse Costing
Manufacturer
Rohm
Reference
DC/DC Micro Converter
Device type
Published
22/01/2013
Product Code
SP13113
Applications
Industrial
Flyer Sample

Texas Instruments – MicroSiP™ Module Using AT&S ECP® Process

Report type
Reverse Costing
Manufacturer
Texas Instrument
Reference
MicroSiP™
Device type
Published
22/02/2012
Product Code
SP12079
Applications
Flyer Sample

Infineon X-GOLD™ 213 – eWLB Package

Report type
Reverse Costing
Manufacturer
Infineon
Reference
IFX213
Device type
Published
08/02/2010
Product Code
SP10026
Applications
Mobile & Consumer
Flyer Sample
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