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New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
3D Packaging, WLP
Published
18/10/2016
Product Code
SP16290
Applications
Consumer
Available flyer Available sample
Fan-Out activity revenues forecast (M$) - Breakdown by Fan-Out market type

Fan-Out: Technologies & Market Trends 2016

Report type
Market & Technology Report
Manufacturer
Reference
Fan-Out 2016
Device type
Market report, WLP
Published
26/08/2016
Product Code
Yole Développement report
Applications
Available flyer Available sample
Intel® Curie™ Module High Density System-in-Package for IoT, Ultra-small, low-power hardware module for wearables - System Plus Consulting

Intel® Curie™ Module – SiP

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Curie
Device type
SIP
Published
27/07/2016
Product Code
SP16277
Applications
Consumer
Available flyer Available sample
Qualcomm Snapdragon 820 MCeP Pop Embedded die System Plus Consulting

Qualcomm Snapdragon 820 & Samsung Exynos 8 PoP

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm Snapdragon 820
Device type
3D Packaging,
Published
14/06/2016
Product Code
SP16276
Applications
Consumer
Available flyer Available sample
Package Cross-Section Qualcomm Fan-Out WCD9335 - System Plus Consulting

Qualcomm WCD9335

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
WCD9335
Device type
Integrated Circuit, WLP
Published
27/04/2016
Product Code
SP16267
Applications
Consumer
Available flyer Available sample
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