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NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
Published
14/06/2017
Product Code
SP17339
Applications
Industrial Mobile & Consumer
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Adesto CBRAM Memory: Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables - System Plus Consulting

Adesto CBRAM Memory

Report type
Reverse Costing
Manufacturer
Adesto
Reference
Adesto CBRAM
Device type
Published
17/05/2017
Product Code
SP17341
Applications
Medical Mobile & Consumer
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2016 Comparison of Application Processor (AP) Packaging: TSMC’s inFO vs. Amkor’s PoP vs. Samsung’s PoP vs. Shinko’s MCeP - System Plus Consulting

2016 Comparison of Application Processor Packaging

Report type
Reverse Costing
Manufacturer
TSMC
Reference
AP Packaging Comparison
Device type
Published
20/12/2016
Product Code
SP16303
Applications
Mobile & Consumer
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Deep Trench Capcitors as land-side decoupling capacitors and IPD technology from TSMC used for Apple’s A10 application processor - System Plus Consulting

TSMC Deep Trench Capacitor

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC DTC
Device type
Published
18/10/2016
Product Code
SP16300
Applications
Mobile & Consumer
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New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
Published
18/10/2016
Product Code
SP16290
Applications
Mobile & Consumer
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