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FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 series

Report type
Reverse Costing
Manufacturer
Fingerprint Cards
Reference
FPC1268
Device type
FingerPrint,
Published
05/04/2017
Product Code
SP17318
Applications
Consumer
Available flyer Available sample

mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables

Report type
Reverse Costing
Manufacturer
mCube
Reference
mCube MC3672
Device type
3D Packaging, Accelerometer,
Published
08/03/2017
Product Code
SP17315
Applications
Consumer
Available flyer Available sample
2016 Comparison of Application Processor (AP) Packaging: TSMC’s inFO vs. Amkor’s PoP vs. Samsung’s PoP vs. Shinko’s MCeP - System Plus Consulting

2016 Comparison of Application Processor Packaging

Report type
Reverse Costing
Manufacturer
TSMC
Reference
AP Packaging Comparison
Device type
3D Packaging,
Published
20/12/2016
Product Code
SP16303
Applications
Consumer
Available flyer Available sample
New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
3D Packaging, WLP
Published
18/10/2016
Product Code
SP16290
Applications
Consumer
Available flyer Available sample
Fan-Out activity revenues forecast (M$) - Breakdown by Fan-Out market type

Fan-Out: Technologies & Market Trends 2016

Report type
Market & Technology Report
Manufacturer
Reference
Fan-Out 2016
Device type
Market report, WLP
Published
26/08/2016
Product Code
Yole Développement report
Applications
Available flyer Available sample
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