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GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S, GaN Systems
Reference
GS66508T
Device type
Embedded, GaN,
Published
08/10/2015
Product Code
SP15233
Applications
Industrial
Available flyer Available sample

AMD High-Bandwidth Memory

Report type
Reverse Costing
Manufacturer
AMD
Reference
Radeon R9 Fury X
Device type
3D Packaging,
Published
10/09/2015
Product Code
SP15231
Applications
Consumer
Available flyer Available sample

Samsung 3D TSV – Stacked DDR4 DRAM

Report type
Reverse Costing
Manufacturer
Samsung
Reference
3D TSV
Device type
3D Packaging,
Published
07/07/2015
Product Code
SP15226
Applications
Consumer
Available flyer Available sample

SiTime SiT1552 – MEMS Oscillator

Report type
Reverse Costing
Manufacturer
SiTime
Reference
SiT1552
Device type
Oscillator, WLP
Published
02/07/2015
Product Code
SP15214
Applications
Consumer
Available flyer Available sample

GaN Systems GS66508P 650V HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GS66508P
Device type
Embedded, GaN,
Published
08/01/2015
Product Code
SP15202
Applications
Available flyer Available sample
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