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SP19478 - Qorvo QM76018 RF SiP Apple iPhone Xr_3_logo

Qorvo QM76018 RFFEM in the Apple iPhone Xr

Report type
Reverse Costing
Manufacturer
Apple, Qorvo
Reference
Qorvo QM76018 RFFEM
Device type
RF IC, SIP
Published
09/10/2019
Product Code
SP19478
Applications
Consumer
Available flyer Available sample
SP19486- ASE-Deca M-Series Fan-Out Process_1

ASE/Deca M-Series Fan-Out Process

Report type
Reverse CostingReverse Technology
Manufacturer
ASE, Deca Technologies, Qualcomm
Reference
ASE/Deca M-Series Fan-Out Process
Device type
WLP
Published
25/09/2019
Product Code
SP19486
Applications
Consumer
Available flyer Available sample
Qualcomm 5G mmWave chipset SDX50M and QTM052_2

Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052

Report type
Reverse CostingReverse Technology
Manufacturer
Qualcomm
Reference
Qualcomm 5G mmWave Chipset
Device type
RF IC, SIP
Published
05/09/2019
Product Code
SP19482
Applications
Consumer
Available flyer Available sample

Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset

Report type
Reverse CostingReverse Technology
Manufacturer
Texas Instrument
Reference
Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset
Device type
3D Packaging, RF IC
Published
08/08/2019
Product Code
SP19481
Applications
Automotive Industrial
Available flyer Available sample
5G network wireless systems, smart city and internet of things concept with icons on smartphone'screen. vector illustration.

5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019

Report type
Market & Technology Report
Manufacturer
Reference
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019
Device type
RF IC, SIP
Published
31/07/2019
Product Code
YD19034
Applications
Consumer
Available flyer Available sample
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