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SP19425 - SEMCO Embedded Die in Qualcomm QET5100M_1

Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QET5100M Envelope Tracker Module
Device type
Embedded,
Published
06/11/2019
Product Code
SP19425
Applications
Consumer
Available flyer Available sample
SP19478 - Qorvo QM76018 RF SiP Apple iPhone Xr_3_logo

Qorvo QM76018 RFFEM in the Apple iPhone Xr

Report type
Reverse Costing
Manufacturer
Apple, Qorvo
Reference
Qorvo QM76018 RFFEM
Device type
RF IC, SIP
Published
09/10/2019
Product Code
SP19478
Applications
Consumer
Available flyer Available sample
SP19486- ASE-Deca M-Series Fan-Out Process_1

ASE/Deca M-Series Fan-Out Process

Report type
Reverse CostingReverse Technology
Manufacturer
ASE, Deca Technologies, Qualcomm
Reference
ASE/Deca M-Series Fan-Out Process
Device type
WLP
Published
25/09/2019
Product Code
SP19486
Applications
Consumer
Available flyer Available sample
Qualcomm 5G mmWave chipset SDX50M and QTM052_2

Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052

Report type
Reverse CostingReverse Technology
Manufacturer
Qualcomm
Reference
Qualcomm 5G mmWave Chipset
Device type
RF IC, SIP
Published
05/09/2019
Product Code
SP19482
Applications
Consumer
Available flyer Available sample

Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset

Report type
Reverse CostingReverse Technology
Manufacturer
Texas Instrument
Reference
Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset
Device type
3D Packaging, RF IC
Published
08/08/2019
Product Code
SP19481
Applications
Automotive Industrial
Available flyer Available sample
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