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Discrete Power Device Packaging Comparison - Packaging design in descrete power devices - System Plus Consulting

Discrete Power Device Packaging Comparison 2021

Report type
Reverse Costing
Manufacturer
Infineon, Littelfuse, Microship, Nexperia, Nuvoton, ON Semiconductor, Rohm, STMicroelectronics, Taiwan Semiconductor, Texas Instrument, Toshiba, Vishay
Reference
Device type
Published
28/10/2021
Product Code
SPR21596
Applications
Automotive & Mobility Industrial
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TPMS Comparison 2021 - System Plus Consulting

TPMS Comparison 2021

Report type
Reverse Costing
Manufacturer
Infineon, Melexis, NXP, Senasic, Sensata
Reference
TPMS
Device type
Published
21/10/2021
Product Code
SPR21601
Applications
Automotive & Mobility
Flyer Sample
Integrated Passive Devices Comparison 2021 - Die Topsides - Optical View - System Plus Consulting

Integrated Passive Devices Comparison 2021

Report type
Reverse Costing
Manufacturer
Qorvo, Skyworks, STMicroelectronics, TSMC, UMC
Reference
Device type
Published
14/10/2021
Product Code
SPR21535
Applications
Industrial Mobile & Consumer Telecom & Infrastructure
Flyer Sample
AMD Ryzen 5 Pro SoC Central Processing Unit - Package Cross-Section - System Plus Consulting

AMD Ryzen 5 Pro SoC Central Processing Unit

Report type
Reverse Costing
Manufacturer
AMD
Reference
Ryzen 5 Pro
Device type
Published
13/10/2021
Product Code
SPR21637
Applications
Mobile & Consumer
Flyer Sample
MediaTek T750 5G Sub-6 platform for CPE devices - T750 Platform - System Plus Consulting

MediaTek T750 5G Sub-6 platform for CPE devices

Report type
Reverse Costing
Manufacturer
Reference
MediaTek T750
Device type
Published
14/09/2021
Product Code
SPR21634
Applications
Mobile & Consumer
Flyer Sample
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