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Mitsubishi J1- Series 650V High-Power Modules for Automotive

Report type
Reverse CostingReverse Technology
Manufacturer
Mitsubishi
Reference
Mitsubishi J1- Series 650V High-Power Modules for Automotive
Device type
IGBT, Si Diode
Published
10/10/2018
Product Code
SP18408
Applications
Automotive Industrial
Available flyer Available sample

STMicroelectronics ToF Proximity Sensor & Flood Illuminator in the Apple iPhone X – Patent-to-Product Mapping

Report type
Patent
Manufacturer
Apple
Reference
STMicroelectronics ToF Proximity Sensor & Flood Illuminator in the Apple iPhone X - Patent-to-Product Mapping
Device type
Published
09/08/2018
Product Code
KM18006
Applications
Available flyer Available sample

Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution

Report type
Reverse Technology
Manufacturer
Reference
Peraso X710 CHipset
Device type
RF IC, SIP
Published
01/08/2018
Product Code
SP18418
Applications
Consumer
Available flyer Available sample

Power Module Packaging 2018: Material Market and Technology Trends

Report type
Manufacturer
Infineon, Intel, Mitsubishi, Semikron, STMicroelectronics
Reference
Power Module Packaging 2018
Device type
Published
26/07/2018
Product Code
YD18032
Applications
Available flyer Available sample

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample
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