Follow us :

fren

Wafer to Wafer Permanent Bonding Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Wafer Permanent Bonding Comparison 2018
Device type
Published
20/11/2018
Product Code
18430
Applications
Automotive Consumer Industrial
Available flyer Available sample

Bonding and Lithography Equipment Market for More than Moore Devices

Report type
Market & Technology Report
Manufacturer
Reference
Bonding and Lithography Equipment Market for More than Moore Devices
Device type
Published
21/11/2018
Product Code
YD18038
Applications
Industrial
Available flyer Available sample

Xiaomi Mi 8 Explorer Teardown and Identification of Key Components

Report type
Reverse CostingReverse Technology
Manufacturer
Xiaomi
Reference
Xiaomi Mi 8 Explorer Teardown
Device type
Telecom
Published
19/11/2018
Product Code
SP18437
Applications
Consumer
Available flyer Available sample

Oppo Find X Teardown and Identification of Key Components

Report type
Reverse Technology
Manufacturer
Oppo
Reference
Oppo Find X Teardown
Device type
Published
23/10/2018
Product Code
SP18435
Applications
Consumer
Available flyer Available sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample
© Copyright 2018 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions