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SP19514 -Nvidia Tegra K1 Visual Computing Module_1

Nvidia Tegra K1 Visual Computing Module

Report type
Reverse Costing
Manufacturer
Reference
Nvidia Tegra K1 VCM
Device type
Memory, SIP
Published
17/12/2019
Product Code
SP19514
Applications
Automotive
Available flyer Available sample
SP19425 - SEMCO Embedded Die in Qualcomm QET5100M_1

Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QET5100M Envelope Tracker Module
Device type
Embedded,
Published
06/11/2019
Product Code
SP19425
Applications
Consumer
Available flyer Available sample
SP19478 - Qorvo QM76018 RF SiP Apple iPhone Xr_3_logo

Qorvo QM76018 RFFEM in the Apple iPhone Xr

Report type
Reverse Costing
Manufacturer
Apple, Qorvo
Reference
Qorvo QM76018 RFFEM
Device type
RF IC, SIP
Published
09/10/2019
Product Code
SP19478
Applications
Consumer
Available flyer Available sample
SP19486- ASE-Deca M-Series Fan-Out Process_1

ASE/Deca M-Series Fan-Out Process

Report type
Reverse CostingReverse Technology
Manufacturer
ASE, Deca Technologies, Qualcomm
Reference
ASE/Deca M-Series Fan-Out Process
Device type
WLP
Published
25/09/2019
Product Code
SP19486
Applications
Consumer
Available flyer Available sample
Qualcomm 5G mmWave chipset SDX50M and QTM052_2

Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052

Report type
Reverse CostingReverse Technology
Manufacturer
Qualcomm
Reference
Qualcomm 5G mmWave Chipset
Device type
RF IC, SIP
Published
05/09/2019
Product Code
SP19482
Applications
Consumer
Available flyer Available sample
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