Follow us :

SP20479-Fan-Out Packaging Processes Comparison 2020_1

Fan-Out Packaging Processes Comparison 2020

Report type
Reverse Costing
Manufacturer
Reference
Fan-Out Packaging Processes Comparison 2020
Device type
Embedded, SIP, WLP
Published
04/02/2020
Product Code
SP20479
Applications
Automotive Consumer Industrial
Available flyer Available sample
SP19486- ASE-Deca M-Series Fan-Out Process_1

ASE/Deca M-Series Fan-Out Process

Report type
Reverse CostingReverse Technology
Manufacturer
ASE, Deca Technologies, Qualcomm
Reference
ASE/Deca M-Series Fan-Out Process
Device type
WLP
Published
25/09/2019
Product Code
SP19486
Applications
Consumer
Available flyer Available sample

Ainstein K-77 Long Range Radar featuring Calterah CAL77A2T4R FOWLP Transceiver

Report type
Reverse CostingReverse Technology
Manufacturer
Ainstein, Calterah
Reference
Ainstein K-77 Radar & Calterah CAL77A2T4R
Device type
RF IC, WLP
Published
09/01/2019
Product Code
SP19400
Applications
Automotive
Available flyer Available sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample
Samsung Galaxy S9+ Teardown and Identification of key devices, advanced packaging technical choices and main suppliers - System Plus Consulting

Samsung Galaxy S9+ Teardown and Identification of Key Components

Report type
Reverse TechnologySystem
Manufacturer
Samsung
Reference
Samsung S9+
Device type
Telecom, WLP
Published
28/03/2018
Product Code
SP18402
Applications
Consumer
Available flyer Available sample
© Copyright 2020 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions