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SP20555-Package on Package Cross Section

Intel Foveros 3D Packaging Technology

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Foveros 3D Packaging Technology
Device type
3D Packaging, RF IC, SIP, WLP
Published
25/09/2020
Product Code
SP20555
Applications
Consumer
Available flyer Available sample
LIDAR module Apple iPad Pro LiDAR

Apple iPad Pro LiDAR Module

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple iPad Pro 11 LiDAR
Device type
Infrared, Integrated Circuit, WLP
Published
03/06/2020
Product Code
SP20557
Applications
Consumer
Available flyer Available sample
Antenna in package Mediatek eWLP AiP Radar chipset - System Plus Consulting

Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset

Report type
Reverse Costing
Manufacturer
Mediatek
Reference
Mediatek Autus R10 (MT2706)
Device type
RF IC, WLP
Published
15/04/2020
Product Code
SP20556
Applications
Automotive
Available flyer Available sample
SP20519-CT Scan of the Antenna-on-Package

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Report type
Reverse Costing
Manufacturer
Google, Infineon, Knowles
Reference
Google Pixel 4XL Gesture Recognition
Device type
3D Packaging, RF IC, WLP
Published
08/04/2020
Product Code
SP20519
Applications
Consumer
Available flyer Available sample
SP20479-Fan-Out Packaging Processes Comparison 2020_1

Fan-Out Packaging Processes Comparison 2020

Report type
Reverse Costing
Manufacturer
Reference
Fan-Out Packaging Processes Comparison 2020
Device type
Embedded, SIP, WLP
Published
04/02/2020
Product Code
SP20479
Applications
Automotive Consumer Industrial
Available flyer Available sample
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