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Advanced RF System-in-Package for Cell Phones 2017: 5G mmWave, 5G sub 6 GHz - which packaging architectures can rise to the occasion? - Yole Développement

Advanced RF System-in-Package for Cell Phones Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
RF SiP
Device type
Market report, RF IC, SIP
Published
15/11/2017
Product Code
YDAP17041
Applications
Consumer
Available flyer Available sample
NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/06/2017
Product Code
SP17339
Applications
Consumer Industrial
Available flyer Available sample
Intel® Curie™ Module High Density System-in-Package for IoT, Ultra-small, low-power hardware module for wearables - System Plus Consulting

Intel® Curie™ Module – SiP

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Curie
Device type
SIP
Published
27/07/2016
Product Code
SP16277
Applications
Consumer
Available flyer Available sample
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