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5G network wireless systems, smart city and internet of things concept with icons on smartphone'screen. vector illustration.

5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019

Report type
Market & Technology Report
Manufacturer
Reference
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019
Device type
RF IC, SIP
Published
31/07/2019
Product Code
YD19034
Applications
Consumer
Available flyer Available sample
SP19445-Broadcom AFEM-8092_2

Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series

Report type
Reverse CostingReverse Technology
Manufacturer
Broadcom
Reference
Broadcom AFEM-8092
Device type
RF IC, SIP
Published
20/02/2019
Product Code
SP19445
Applications
Consumer
Available flyer Available sample

Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type
Reverse CostingReverse Technology
Manufacturer
Apple
Reference
Apple Watch S4 SiP
Device type
3D Packaging, Embedded, SIP
Published
23/01/2019
Product Code
SP19439
Applications
Consumer
Available flyer Available sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample

Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution

Report type
Reverse Technology
Manufacturer
Reference
Peraso X710 CHipset
Device type
RF IC, SIP
Published
01/08/2018
Product Code
SP18418
Applications
Consumer
Available flyer Available sample
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