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SP20523-Main Wifi 6.0 SoC

RF Front-End Module Comparison 2020 – Volume 3

Report type
Reverse Costing
Manufacturer
Reference
RF Front-End Module Comparison 2020 - Volume 3
Device type
RF IC, SIP
Published
01/10/2020
Product Code
SP20523
Applications
Consumer
Available flyer Available sample
SP20555-Package on Package Cross Section

Intel Foveros 3D Packaging Technology

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Foveros 3D Packaging Technology
Device type
3D Packaging, RF IC, SIP, WLP
Published
25/09/2020
Product Code
SP20555
Applications
Consumer
Available flyer Available sample
Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting

Qualcomm’s Second Generation 5G mmWave Chipset, from Modem to Antenna

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm SDX55M SMR526 QTM525
Device type
RF IC, SIP
Published
07/05/2020
Product Code
SP20517
Applications
Consumer
Available flyer Available sample
AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
3D Packaging, SIP
Published
11/03/2020
Product Code
SP20471
Applications
Consumer
Available flyer Available sample
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series

Report type
Reverse Costing
Manufacturer
Broadcom
Reference
Broadcom AFEM-8100
Device type
RF IC, SIP
Published
04/03/2020
Product Code
SP20521
Applications
Consumer
Available flyer Available sample
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