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NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/06/2017
Product Code
SP17339
Applications
Consumer Industrial
Flyer Sample

GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S, GaN Systems
Reference
GS66508T
Device type
Embedded, GaN,
Published
08/10/2015
Product Code
SP15233
Applications
Industrial
Flyer Sample

GaN Systems GS66508P 650V HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GS66508P
Device type
Embedded, GaN,
Published
08/01/2015
Product Code
SP15202
Applications
Flyer Sample

GaN Systems HEMT Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S
Reference
GS66508P
Device type
Embedded, GaN,
Published
15/01/2015
Product Code
RS202
Applications
Industrial
Flyer Sample

TDK-EPC P8009 Module with Maxim Embedded Dies

Report type
Reverse Costing
Manufacturer
TDK
Reference
P8009
Device type
Embedded,
Published
05/06/2013
Product Code
SP13133
Applications
Flyer Sample
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