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Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
3D Packaging, Embedded,
Published
16/10/2018
Product Code
SP18417
Applications
Consumer
Flyer Sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Flyer Sample
GaN on Silicon Transistor Comparison 2018: technology and cost of GaN-on-Si HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments - by System Plus Consulting

GaN-on-Silicon Transistor Comparison 2018

Report type
Manufacturer
EPC Corporation, GaN Systems, Panasonic, Texas Instrument, Transphorm
Reference
GaN
Device type
Embedded, GaN,
Published
04/04/2018
Product Code
SP18365
Applications
Consumer Industrial
Flyer Sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Flyer Sample

TDK SESUB Bluetooth Module

Report type
Reverse Costing
Manufacturer
TDK
Reference
TDK SESUB
Device type
Embedded,
Published
21/06/2017
Product Code
SP17306
Applications
Consumer
Flyer Sample
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