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SP19425 - SEMCO Embedded Die in Qualcomm QET5100M_1

Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QET5100M Envelope Tracker Module
Device type
Embedded,
Published
06/11/2019
Product Code
SP19425
Applications
Consumer
Available flyer Available sample

Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type
Reverse CostingReverse Technology
Manufacturer
Apple
Reference
Apple Watch S4 SiP
Device type
3D Packaging, Embedded, SIP
Published
23/01/2019
Product Code
SP19439
Applications
Consumer
Available flyer Available sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample

Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
3D Packaging, Embedded,
Published
16/10/2018
Product Code
SP18417
Applications
Consumer
Available flyer Available sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Available flyer Available sample
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