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2016 Comparison of Application Processor (AP) Packaging: TSMC’s inFO vs. Amkor’s PoP vs. Samsung’s PoP vs. Shinko’s MCeP - System Plus Consulting

2016 Comparison of Application Processor Packaging

Report type
Reverse Costing
Manufacturer
TSMC
Reference
AP Packaging Comparison
Device type
3D Packaging,
Published
20/12/2016
Product Code
SP16303
Applications
Consumer
Flyer Sample
New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
3D Packaging, WLP
Published
18/10/2016
Product Code
SP16290
Applications
Consumer
Flyer Sample
Qualcomm Snapdragon 820 MCeP Pop Embedded die System Plus Consulting

Qualcomm Snapdragon 820 & Samsung Exynos 8 PoP

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm Snapdragon 820
Device type
3D Packaging,
Published
14/06/2016
Product Code
SP16276
Applications
Consumer
Flyer Sample

AMD High-Bandwidth Memory

Report type
Reverse Costing
Manufacturer
AMD
Reference
Radeon R9 Fury X
Device type
3D Packaging,
Published
10/09/2015
Product Code
SP15231
Applications
Consumer
Flyer Sample

Samsung 3D TSV – Stacked DDR4 DRAM

Report type
Reverse Costing
Manufacturer
Samsung
Reference
3D TSV
Device type
3D Packaging,
Published
07/07/2015
Product Code
SP15226
Applications
Consumer
Flyer Sample
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