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NVIDIA Tesla P100 Graphics Processing Unit (GPU) with HBM2 - TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging - System Plus Consulting

NVIDIA Tesla P100 GPU with HBM2

Report type
Reverse Costing
Manufacturer
NVIDIA
Reference
NVIDIA Tesla
Device type
3D Packaging,
Published
18/10/2017
Product Code
SP17353
Applications
Consumer
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Sony IMX400 impressive, industry-first Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP - System Plus Consulting

Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP

Report type
Reverse Costing
Manufacturer
SONY
Reference
Sony IMX400
Device type
3D Packaging, Visible
Published
19/07/2017
Product Code
SP17343
Applications
Consumer
Flyer Sample
NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/06/2017
Product Code
SP17339
Applications
Consumer Industrial
Flyer Sample

Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Flyer Sample

mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables

Report type
Reverse Costing
Manufacturer
mCube
Reference
mCube MC3672
Device type
3D Packaging, Accelerometer,
Published
08/03/2017
Product Code
SP17315
Applications
Consumer
Flyer Sample
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