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Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample

Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Report type
Reverse CostingReverse Technology
Manufacturer
Intel
Reference
Intel’s EMIB
Device type
3D Packaging, Embedded,
Published
16/10/2018
Product Code
SP18417
Applications
Consumer
Available flyer Available sample

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Available flyer Available sample

GaN Systems GS61004B GaN HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GaN Systems GS61004B GaN HEMT
Device type
3D Packaging, GaN,
Published
06/06/2018
Product Code
SP18391
Applications
Automotive Consumer Industrial
Available flyer Available sample
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