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SP20555-Package on Package Cross Section

Intel Foveros 3D Packaging Technology

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Foveros 3D Packaging Technology
Device type
3D Packaging, RF IC, SIP, WLP
Published
25/09/2020
Product Code
SP20555
Applications
Consumer
Available flyer Available sample
SP20519-CT Scan of the Antenna-on-Package

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Report type
Reverse Costing
Manufacturer
Google, Infineon, Knowles
Reference
Google Pixel 4XL Gesture Recognition
Device type
3D Packaging, RF IC, WLP
Published
08/04/2020
Product Code
SP20519
Applications
Consumer
Available flyer Available sample
AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
3D Packaging, SIP
Published
11/03/2020
Product Code
SP20471
Applications
Consumer
Available flyer Available sample

Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset

Report type
Reverse CostingReverse Technology
Manufacturer
Texas Instrument
Reference
Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset
Device type
3D Packaging, RF IC
Published
08/08/2019
Product Code
SP19481
Applications
Automotive Industrial
Available flyer Available sample

Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type
Reverse CostingReverse Technology
Manufacturer
Apple
Reference
Apple Watch S4 SiP
Device type
3D Packaging, Embedded, SIP
Published
23/01/2019
Product Code
SP19439
Applications
Consumer
Available flyer Available sample
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