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SP20519-CT Scan of the Antenna-on-Package

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Report type
Reverse Costing
Manufacturer
Google, Infineon, Knowles
Reference
Google Pixel 4XL Gesture Recognition
Device type
3D Packaging, RF IC, WLP
Published
08/04/2020
Product Code
SP20519
Applications
Consumer
Available flyer Available sample
AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
3D Packaging, SIP
Published
11/03/2020
Product Code
SP20471
Applications
Consumer
Available flyer Available sample

Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset

Report type
Reverse CostingReverse Technology
Manufacturer
Texas Instrument
Reference
Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset
Device type
3D Packaging, RF IC
Published
08/08/2019
Product Code
SP19481
Applications
Automotive Industrial
Available flyer Available sample

Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

Report type
Reverse CostingReverse Technology
Manufacturer
Apple
Reference
Apple Watch S4 SiP
Device type
3D Packaging, Embedded, SIP
Published
23/01/2019
Product Code
SP19439
Applications
Consumer
Available flyer Available sample
Samsung first ultra-small multi-chip High Volume Manufacturing (HVM) Fan-Out Panel Level Packaging (FO-PLP) device for consumer applications found in the Galaxy Watch

Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Exynos 9110
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/11/2018
Product Code
SP18444
Applications
Consumer
Available flyer Available sample
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