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Package Cross Section - System Plus Consulting

Qualcomm Snapdragon 888 System on Chip with 5G Modem

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Snapdragon 888
Device type
3D Packaging, Integrated Circuit
Published
19/05/2021
Product Code
SPR21612
Applications
Consumer
Flyer Sample
SPR21579 - Package cross section - NVIDIA A100 Ampere GPU - System Plus Consulting

NVIDIA A100 Ampere GPU

Report type
Reverse Costing
Manufacturer
TSMC
Reference
NVIDIA A100
Device type
3D Packaging, Embedded,
Published
11/02/2021
Product Code
SPR21579
Applications
Industrial Medical
Flyer Sample
SP20555-Package on Package Cross Section

Intel Foveros 3D Packaging Technology

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Foveros 3D Packaging Technology
Device type
3D Packaging, RF IC, SIP, WLP
Published
25/09/2020
Product Code
SP20555
Applications
Consumer
Flyer Sample
SP20519-CT Scan of the Antenna-on-Package

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Report type
Reverse Costing
Manufacturer
Google, Infineon, Knowles
Reference
Google Pixel 4XL Gesture Recognition
Device type
3D Packaging, RF IC, WLP
Published
08/04/2020
Product Code
SP20519
Applications
Consumer
Flyer Sample
AirPods SiP Audio Module - System Plus Consulting

Advanced System-in-Package Technology in Apple’s AirPods Pro

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple AirPods Pro audio codec module
Device type
3D Packaging, SIP
Published
11/03/2020
Product Code
SP20471
Applications
Consumer
Flyer Sample
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