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Apple iPhone X Special Offer: Get access to all the iPhone X components analyzed by System Plus Consulting

Apple iPhone X Special Offer

Report type
Reverse Costing
Manufacturer
Apple
Reference
AS iPhone X
Device type
IMU/Combo, Infrared, Light, RF IC, Visible
Published
12/12/2017
Product Code
AS iPhone X
Applications
Consumer
Available flyer Available sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
Market report,
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample
InvenSense ICM20789: High Performance 6-Axis Motion Sensor & Pressure Sensor Combo first ‘7-Axis’ motion tracking device targeting drone applications

InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo

Report type
Reverse Costing
Manufacturer
Invensense
Reference
InvenSense ICM-20789
Device type
IMU/Combo,
Published
04/10/2017
Product Code
SP17361
Applications
Consumer
Available flyer Available sample
MEMS & Sensor for Automotive - Yole Développement

MEMS and Sensors for Automotive – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS & Sensors for Automotive
Device type
Market report,
Published
23/08/2017
Product Code
YDMS17033
Applications
Automotive
Available flyer Available sample
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