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Available reports ( 393 )

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Gas and Particle Sensors 2018

Report type
Market & Technology Report
Manufacturer
AKM, Amphenol, AMS, Bosch, Delphi, Denso, Honeywell, Infineon, LG, Murata, NXP, Schneider Electric, Sensata, Sensirion, Sharp, TDK
Reference
Gas and Particle Sensors
Device type
Environment, Market report,
Published
10/11/2018
Product Code
YD18046
Applications
Automotive Consumer Industrial Medical
Available flyer Available sample

Miniaturized Gas Sensor Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
AMS, Bosch, Sensirion
Reference
Miniaturized Gas Sensor Comparison 2018
Device type
Environment,
Published
02/10/2018
Product Code
SP18398
Applications
Consumer
Available flyer Available sample
Status of the MEMS Industry 2018: Megatrends are invigorating the MEMS industry - Market and Technology report by Yole Développpement

Status of the MEMS Industry 2018

Report type
Market & Technology Report
Manufacturer
AAC Acoustic, AAC Technologies, Alps, Amphenol, AMS, Analog Devices, APM, Apple, Bosch, Broadcom, Denso, Epcos, Epson, First Sensor, Flir, Goertek, Honeywell, Infineon, Knowles, mCube, Melexis, Murata, NXP, Omron, ON Semiconductor, Philips, Qorvo, Qualcomm, Raytheon, Rohm, Samsung, Sensata, Sensirion, Sensonor, Silicon Sensing, SiTime, SMIC, SONY, STMicroelectronics, TDK, Texas Instrument, Yamaha
Reference
Yole Développement report
Device type
Accelerometer, Compass, Display / Optics, Environment, Gyroscope, IMU/Combo, Light, Market report, Microphone, Oscillator, Pressure sensor,
Published
16/05/2018
Product Code
YD18019
Applications
Automotive Consumer Industrial Medical
Available flyer Available sample

SGP30 Gas Sensor from Sensirion

Report type
Reverse Costing
Manufacturer
Sensirion
Reference
Sensirion SGP30 Gas Sensor
Device type
Environment,
Published
21/02/2018
Product Code
SP18372
Applications
Consumer Medical
Available flyer Available sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample
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