MEMS Packaging: Reverse Technology Review
- Report type
- Reverse Technology
- Manufacturer
- Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
- Reference
- MEMS Packaging
- Device type
- 3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
- Published
- 25/10/2017
- Product Code
- SP17352
- Applications
- Automotive Consumer
