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LPDDR5 Memory Comparison 2022 - SK-hynix-die-cross-section-–-capacitors-&-top-metal-layers - System Plus Consulting

LPDDR5 Memory Comparison 2022

Report type
Reverse Costing
Manufacturer
Reference
Device type
Published
17/02/2022
Product Code
SPR22527
Applications
Automotive & Mobility
Sample
Samsung 16Gb LPDDR5 1z DRAM Memory -Samsung LPDDR5 Die Cross Section - System Plus Consulting

Samsung 16Gb LPDDR5 1z DRAM Memory

Report type
Reverse Costing
Manufacturer
Samsung
Reference
K3LK7K7OBM
Device type
Published
09/12/2021
Product Code
SPR21618
Applications
Mobile & Consumer
Sample Flyer
3D NAND Memory Comparison 2021 - Samsung’s 128-layer Die cross section - System Plus Consulting

3D NAND Memory Comparison 2021

Report type
Reverse Costing
Manufacturer
Intel, Samsung, SK hynix
Reference
3D NAND
Device type
Published
25/11/2021
Product Code
SPR21528
Applications
Mobile & Consumer
Sample Flyer

Samsung 128-layer V-NAND Memory

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Device type
Published
04/11/2021
Product Code
SPR21584
Applications
Mobile & Consumer
Sample Flyer
Intel 144 layer 3D NAND Memory - Memory Die Staircase Region - System Plus Consulting

Intel 144-layer 3D NAND Memory

Report type
Reverse Costing
Manufacturer
Intel
Reference
Device type
Published
03/11/2021
Product Code
SPR21616
Applications
Mobile & Consumer Telecom & Infrastructure
Sample Flyer
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