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3D NAND Memory Comparison 2021 - Samsung’s 128-layer Die cross section - System Plus Consulting

3D NAND Memory Comparison 2021

Report type
Reverse Costing
Manufacturer
Intel, Samsung, SK hynix
Reference
3D NAND
Device type
Published
25/11/2021
Product Code
SPR21528
Applications
Mobile & Consumer
Flyer Sample

Samsung 128-layer V-NAND Memory

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Device type
Published
04/11/2021
Product Code
SPR21584
Applications
Mobile & Consumer
Flyer Sample
Intel 144 layer 3D NAND Memory - Memory Die Staircase Region - System Plus Consulting

Intel 144-layer 3D NAND Memory

Report type
Reverse Costing
Manufacturer
Intel
Reference
Device type
Published
03/11/2021
Product Code
SPR21616
Applications
Mobile & Consumer Telecom & Infrastructure
Flyer Sample
AMD Ryzen 5 Pro SoC Central Processing Unit - Package Cross-Section - System Plus Consulting

AMD Ryzen 5 Pro SoC Central Processing Unit

Report type
Reverse Costing
Manufacturer
AMD
Reference
Ryzen 5 Pro
Device type
Published
13/10/2021
Product Code
SPR21637
Applications
Mobile & Consumer
Flyer Sample
SK hynix 128-Layer NAND Memory - Memory Die Cross-Section - System Plus Consulting

SK hynix 128-Layer NAND Memory

Report type
Reverse Costing
Manufacturer
Intel, Kioxia, Micron, MXIC, Samsung, SK hynix, Toshiba, Western Digital, Yangtze, YMTC
Reference
3D-NAND memory
Device type
Published
10/08/2021
Product Code
SPR21583
Applications
Mobile & Consumer
Flyer Sample
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