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Die Cross Section Everspin EMD3D256M STTMRAM

Everspin EMD3D256M STTMRAM Memory

Report type
Reverse Costing
Manufacturer
Everspin
Reference
EMD3D256M
Device type
Memory
Published
09/06/2020
Product Code
SP20543
Applications
Consumer
Available flyer Available sample
LIDAR module Apple iPad Pro LiDAR

Apple iPad Pro LiDAR Module

Report type
Reverse Costing
Manufacturer
Apple
Reference
Apple iPad Pro 11 LiDAR
Device type
Infrared, Integrated Circuit, WLP
Published
03/06/2020
Product Code
SP20557
Applications
Consumer
Available flyer Available sample
Qualcomm 5G mmWave Chipset Second Generation - System Plus Consulting

Qualcomm’s Second Generation 5G mmWave Chipset, from Modem to Antenna

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm SDX55M SMR526 QTM525
Device type
RF IC, SIP
Published
07/05/2020
Product Code
SP20517
Applications
Consumer
Available flyer Available sample
SP20522-Smartphone Overview

RF Front-End Module Comparison 2020 – Volume 2

Report type
Reverse Costing
Manufacturer
Reference
RF Front-End Module Comparison 2020 – Volume 2
Device type
RF IC
Published
29/04/2020
Product Code
SP20522
Applications
Consumer
Available flyer Available sample
SP20551-Intel Optane 128GB DIMM

Intel Optane 128GB DIMM

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Optane 128GB DIMM
Device type
Memory
Published
22/04/2020
Product Code
SP20551
Applications
Consumer
Available flyer Available sample
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