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Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample

Intel RealSense D435 3D Active IR Stereo Depth Camera

Report type
System
Manufacturer
Intel
Reference
Intel RealSense D435 3D Active IR Stereo Depth Camera
Device type
Consumer, Infrared, Integrated Circuit, Visible
Published
31/05/2018
Product Code
SP18404
Applications
Consumer
Available flyer Available sample
RF Front-End Module Comparison 2018: 40 modules and components found in 10 flagship products

RF Front-End Module Comparison 2018

Report type
Reverse Technology
Manufacturer
Apple, Huawei, Samsung, SONY, Xiaomi
Reference
RFFE Module
Device type
RF IC
Published
17/04/2018
Product Code
SP18389
Applications
Consumer
Available flyer Available sample

AWR1642 77 & 79 GHz RFCMOS Radar Chipset from Texas Instruments

Report type
Reverse Costing
Manufacturer
Texas Instrument
Reference
AWR1642 from Texas Instruments
Device type
Published
04/04/2018
Product Code
SP18394
Applications
Automotive Industrial
Available flyer Available sample
Broadcom AFEM-8072: the first Mid and High Band Long Term Evolution (LTE) RF Front-End Module (FEM) in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging - System Plus Consulting

Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM)

Report type
Reverse Costing
Manufacturer
Broadcom
Reference
Broadcom AFEM-8072
Device type
RF IC
Published
27/02/2018
Product Code
SP18379
Applications
Consumer
Available flyer Available sample
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