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LPDDR5 Die Cross-Section Micron 12GB Mobile Memory - System Plus Consulting

Micron LPDDR5 12GB Mobile Memory

Report type
Reverse Costing
Manufacturer
Micron
Reference
Micron LPDDR5 12GB
Device type
Integrated Circuit, Memory
Published
15/10/2020
Product Code
SP20566
Applications
Automotive Consumer
Available flyer Available sample
SP20523-Main Wifi 6.0 SoC

RF Front-End Module Comparison 2020 – Volume 3

Report type
Reverse Costing
Manufacturer
Reference
RF Front-End Module Comparison 2020 - Volume 3
Device type
RF IC, SIP
Published
01/10/2020
Product Code
SP20523
Applications
Consumer
Available flyer Available sample
SP20555-Package on Package Cross Section

Intel Foveros 3D Packaging Technology

Report type
Reverse Costing
Manufacturer
Intel
Reference
Intel Foveros 3D Packaging Technology
Device type
3D Packaging, RF IC, SIP, WLP
Published
25/09/2020
Product Code
SP20555
Applications
Consumer
Available flyer Available sample
SP20561-Main RF SoC-2

Vayyar VYYR2401 4D UWB Radar Imaging SoC

Report type
Reverse Costing
Manufacturer
Reference
Vayyar VYYR2401
Device type
RF IC
Published
09/09/2020
Product Code
SP20561
Applications
Consumer
Available flyer Available sample
LPDDR5 Die Cross-section Samsung 12GB Mobile - System Plus Consulting

Samsung LPDDR5 12GB Mobile Memory

Report type
Reverse Costing
Manufacturer
Samsung
Reference
Samsung LPDDR5
Device type
Integrated Circuit, Memory
Published
06/08/2020
Product Code
SP20565
Applications
Automotive Consumer
Available flyer Available sample
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