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Status of the CMOS Image Sensor Industry 2018

Report type
Market & Technology Report
Manufacturer
Reference
Status of CIS 2018
Device type
Photonics
Published
21/09/2018
Product Code
YD18035
Applications
Automotive Consumer Industrial Medical
Available flyer Available sample

Mobile Camera Module Comparison 2019

Report type
Reverse CostingReverse Technology
Manufacturer
Apple, Huawei, Oppo, Samsung, Xiaomi
Reference
Camera Module Comparison 2019
Device type
Published
29/01/2019
Product Code
SP19440
Applications
Consumer
Available flyer Available sample

Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition

Report type
Reverse CostingReverse Technology
Manufacturer
Xiaomi
Reference
Xiaomi Mi 8 Explorer Edition – 3D Depth Sensing System
Device type
Infrared
Published
11/12/2018
Product Code
SP18438
Applications
Consumer
Available flyer Available sample

Orbbec’s Front 3D Depth Sensing System in the Oppo Find X

Report type
Reverse CostingReverse Technology
Manufacturer
Oppo
Reference
Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
Device type
Infrared
Published
28/11/2018
Product Code
SP18434
Applications
Consumer
Available flyer Available sample

Wafer to Wafer Permanent Bonding Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Reference
Wafer Permanent Bonding Comparison 2018
Device type
Published
20/11/2018
Product Code
18430
Applications
Automotive Consumer Industrial
Available flyer Available sample
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